Datasheets
CPC1106N by:

Transistor Output SSR,

Part Details for CPC1106N by Littelfuse Inc

Results Overview of CPC1106N by Littelfuse Inc

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CPC1106N Information

CPC1106N by Littelfuse Inc is a Solid State Relay.
Solid State Relays are under the broader part category of Optoelectronics.

Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.

Price & Stock for CPC1106N

Part # Distributor Description Stock Price Buy
DISTI # CPC1106N-ND
DigiKey SSR RELAY SPST-NC 75MA 0-60V Min Qty: 1 Lead time: 23 Weeks Container: Tube 3181
In Stock
  • 1 $1.5300
  • 10 $1.3620
  • 25 $1.3008
  • 50 $1.2564
  • 100 $1.2133
  • 300 $1.1481
  • 500 $1.1189
  • 1,000 $1.0805
  • 5,000 $0.9963
$0.9963 / $1.5300 Buy Now
DISTI # 75575828
RS 1-FORM-B OPTOMOS 60V 10 OHMS 4L SOP Min Qty: 500 Package Multiple: 1 Lead time: 8 Weeks, 0 Days Container: Bulk 0
  • 500 $1.2600
  • 1,000 $1.2000
  • 2,000 $1.1600
$1.1600 / $1.2600 RFQ

Part Details for CPC1106N

CPC1106N CAD Models

CPC1106N Part Data Attributes

CPC1106N Littelfuse Inc
Buy Now Datasheet
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CPC1106N Littelfuse Inc Transistor Output SSR,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer LITTELFUSE INC
Package Description SOP-4
Reach Compliance Code compliant
Samacsys Manufacturer LITTELFUSE
Additional Feature HIGH RELIABILITY, UL RECOGNIZED
Configuration SINGLE
Control Current 0.00016 A
Control Voltage 0.9 V
Forward Current-Max 0.0005 A
Input Type DC
Isolation Voltage-Max 1500 V
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Elements 1
On-state Resistance-Max 10 Ω
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Optoelectronic Device Type TRANSISTOR OUTPUT SSR
Output Circuit Type MOSFET
Overall Height 2.03 mm
Overall Length 4.089 mm
Packing Method TUBE
Surface Mount YES
Terminal Finish Tin (Sn)

CPC1106N Related Parts

CPC1106N Frequently Asked Questions (FAQ)

  • The recommended PCB layout for CPC1106N involves using a thermal pad with a minimum size of 100mm², and placing multiple vias under the pad to dissipate heat efficiently. Additionally, keeping the thermal pad away from other components and using a thermal relief pattern can help reduce thermal resistance.

  • To ensure reliable operation of CPC1106N in high-temperature environments, it's essential to follow proper derating guidelines, provide adequate heat sinking, and ensure good airflow around the device. Additionally, using a thermally conductive interface material between the device and heat sink can help improve heat transfer.

  • Exceeding the maximum surge current rating of CPC1106N can lead to device failure, including thermal runaway, melting of the internal components, and potentially even a fire hazard. It's crucial to ensure that the device is operated within the specified surge current limits to prevent such failures.

  • Yes, CPC1106N can be used in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalance and thermal mismatch between the devices.

  • To prevent damage, CPC1106N should be stored in a dry, cool place, away from direct sunlight and moisture. The devices should be handled with anti-static precautions, such as using an anti-static wrist strap or mat, and should not be touched by bare hands. Additionally, the devices should be stored in their original packaging or a similar protective package to prevent mechanical damage.

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