Part Details for 5CSTFD5D5F31I7N by Intel Corporation
Results Overview of 5CSTFD5D5F31I7N by Intel Corporation
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- Reference Designs: (Not Available)
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5CSTFD5D5F31I7N Information
5CSTFD5D5F31I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for 5CSTFD5D5F31I7N
5CSTFD5D5F31I7N CAD Models
5CSTFD5D5F31I7N Part Data Attributes
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5CSTFD5D5F31I7N
Intel Corporation
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Datasheet
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5CSTFD5D5F31I7N
Intel Corporation
Field Programmable Gate Array, 85000-Cell, CMOS, PBGA896, ROHS COMPLIANT, FBGA-896
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-896 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B896 | |
| JESD-609 Code | e1 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 469 | |
| Number of Outputs | 469 | |
| Number of Terminals | 896 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 3207 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 31 mm |
5CSTFD5D5F31I7N Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stackup with a minimum of 2 mil trace width and spacing. A dedicated power plane and ground plane are also recommended for optimal signal integrity.
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To optimize power consumption, use the Intel Power Analyzer tool to identify power-hungry components. Implement power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption.
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Use a heat sink with a thermal interface material (TIM) to dissipate heat. Ensure good airflow around the FPGA, and consider using a fan or heat pipe for high-temperature applications.
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Use a reliable configuration device, such as a flash memory or an external memory device. Implement a robust boot-up sequence, including error detection and correction mechanisms.
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Use shielding, filtering, and grounding techniques to minimize EMI. Ensure the PCB layout and component placement minimize radiation and susceptibility to external interference.