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Part Details for 5CGXFC5C6F27C7N by Intel Corporation
Results Overview of 5CGXFC5C6F27C7N by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
5CGXFC5C6F27C7N Information
5CGXFC5C6F27C7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 5CGXFC5C6F27C7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 40 |
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RFQ | |
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Win Source Electronics | IC FPGA 336 I/O 672FBGA | 488 |
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$211.4789 / $235.8803 | Buy Now |
Part Details for 5CGXFC5C6F27C7N
5CGXFC5C6F27C7N CAD Models
5CGXFC5C6F27C7N Part Data Attributes
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5CGXFC5C6F27C7N
Intel Corporation
Buy Now
Datasheet
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5CGXFC5C6F27C7N
Intel Corporation
Field Programmable Gate Array, 76500-Cell, CMOS, PBGA672, ROHS COMPLIANT, FBGA-672
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | ROHS COMPLIANT, FBGA-672 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| JESD-30 Code | S-PBGA-B672 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 368 | |
| Number of Logic Cells | 76500 | |
| Number of Outputs | 368 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 2908 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.13 V | |
| Supply Voltage-Min | 1.07 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27 mm |
5CGXFC5C6F27C7N Frequently Asked Questions (FAQ)
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Intel recommends a 4-6 layer PCB stackup with a minimum of two power planes and two signal layers. A 1-2-1 or 1-2-2 stackup is also acceptable. Ensure a solid ground plane under the FPGA and use a minimum of 10 mils of clearance between the FPGA and other components.
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Use the Intel Power Estimator tool to estimate power consumption. Optimize the design by reducing clock frequencies, using low-power modes, and minimizing toggle rates. Implement power gating and clock gating to reduce dynamic power consumption.
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The 5CGXFC5C6F27C7N has a maximum junction temperature of 100°C. Ensure good airflow around the FPGA, and consider using a heat sink or thermal interface material to reduce thermal resistance. Monitor the FPGA's temperature using the on-chip thermal sensor.
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Use a reliable configuration device, such as a flash memory or an external memory device. Ensure the configuration clock is stable and within the recommended frequency range. Implement a robust boot-up sequence and consider using a boot loader or configuration manager.
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Use controlled impedance routing for high-speed signals, and maintain a consistent signal return path. Avoid routing high-speed signals near the FPGA's power pins. Use Intel's signal integrity guidelines and simulation tools to optimize PCB routing.