Part Details for 10AX066H3F34E2SG by Intel Corporation
Results Overview of 10AX066H3F34E2SG by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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10AX066H3F34E2SG Information
10AX066H3F34E2SG by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for 10AX066H3F34E2SG
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 1 |
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RFQ | |
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Win Source Electronics | IC FPGA 492 I/O 1152FBGA / Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA | 443 |
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$729.8958 | Buy Now |
Part Details for 10AX066H3F34E2SG
10AX066H3F34E2SG CAD Models
10AX066H3F34E2SG Part Data Attributes
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10AX066H3F34E2SG
Intel Corporation
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Datasheet
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10AX066H3F34E2SG
Intel Corporation
Field Programmable Gate Array, 660000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
JESD-30 Code | S-PBGA-B1152 | |
JESD-609 Code | e1 | |
Length | 35 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 25168 | |
Number of Inputs | 492 | |
Number of Logic Cells | 660000 | |
Number of Outputs | 492 | |
Number of Terminals | 1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Organization | 25168 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.35 mm | |
Supply Voltage-Max | 0.93 V | |
Supply Voltage-Min | 0.87 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Technology | TSMC | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 35 mm |
10AX066H3F34E2SG Frequently Asked Questions (FAQ)
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The maximum power consumption of the 10AX066H3F34E2SG FPGA is approximately 12W, but this can vary depending on the specific design and usage.
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Intel recommends using a clocking scheme that includes a clock manager tile (CMT) and a phase-locked loop (PLL) to generate a stable clock signal. Additionally, it's essential to follow Intel's guidelines for clock domain crossing and clock signal routing.
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To optimize your design, use Intel's Quartus Prime software to analyze and optimize your design for area and performance. This includes using the 'Optimize For' feature, which allows you to specify optimization goals, and using the 'Design Space Explorer' to explore different design options.
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To ensure signal integrity, follow Intel's guidelines for signal routing, including using differential signaling, minimizing signal length, and avoiding signal routing near noise sources. Additionally, use Intel's signal integrity analysis tools to identify and mitigate signal integrity issues.
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To ensure reliable operation of the high-speed transceivers, follow Intel's guidelines for transceiver usage, including using the recommended transceiver settings, implementing proper signal termination, and using Intel's transceiver calibration tools.