Filter Your Search
1 - 10 of 64,001,694 results
|
MC0603N100J101CT
SPC Multicomp
|
$0.0005 | Yes | Active | 10 pF | 100 V | 5 % | 0603 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | TR, PAPER, 7 INCH | YES | TIN OVER NICKEL | WRAPAROUND | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||||||||
|
MC0402X104K100CT
SPC Multicomp
|
$0.0010 | Yes | Active | 100 nF | 10 V | 10 % | 0402 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||||
![]() |
CL05F104ZO5NNNC
Samsung Electro-Mechanics
|
$0.0010 | Yes | Yes | Active | 100 nF | 16 V | 80 % | 0402 | Y5V | 20 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | -82/+22% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | SAMSUNG ELECTRO-MECHANICS | CHIP | compliant | EAR99 | 8532.24.00.20 | SAMSUNG | 0402 | |||
|
MC0805N270J500CT
SPC Multicomp
|
$0.0013 | Yes | Yes | Active | 27 pF | 50 V | 5 % | 0805 | NP0 | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR | YES | TIN OVER NICKEL | WRAPAROUND | 2 mm | 1.25 mm | MULTICOMP PRO | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||||||
|
MC0201X473K6R3CT
SPC Multicomp
|
$0.0013 | Yes | Active | 47 nF | 6.3 V | 10 % | 0201 | X5R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 85 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TAPE | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 300 µm | 600 µm | 300 µm | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||||
![]() |
TMK105B7103KV-F
TAIYO YUDEN
|
$0.0013 | Yes | Yes | Not Recommended | 10 nF | 25 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, Paper, 7 Inch | YES | TIN | WRAPAROUND | 500 µm | 1 mm | 500 µm | TAIYO YUDEN CO LTD | CHIP | compliant | EAR99 | 8532.24.00.20 | TAIYO YUDEN | 0402 | |||
![]() |
0402N180J500CT
Walsin Technology Corporation
|
$0.0014 | Yes | Yes | Active | 18 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, PAPER, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | WALSIN TECHNOLOGY CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | Walsin Technology Corporation | ||||
|
MCMT18N220F100CT
SPC Multicomp
|
$0.0014 | Yes | Active | 22 pF | 10 V | 1 % | 0603 | C0G | 1 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | TR, PAPER, 7 INCH | YES | Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | ||||||||
|
MC0402B102K500CT
SPC Multicomp
|
$0.0015 | Yes | Active | 1 nF | 50 V | 10 % | 0402 | X7R | 10 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 15% ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | TR, PAPER, 7 INCH | YES | TIN OVER NICKEL | WRAPAROUND | MULTICOMP PRO | CHIP | unknown | EAR99 | 8532.24.00.20 | Multicomp Pro | |||||||||
![]() |
CL05C151JB5NNNC
Samsung Electro-Mechanics
|
$0.0015 | Yes | Yes | Active | 150 pF | 50 V | 5 % | 0402 | C0G | 5 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, CARDBOARD, 7 INCH | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 550 µm | 1 mm | 500 µm | SAMSUNG ELECTRO-MECHANICS | CHIP | compliant | EAR99 | 8532.24.00.20 | SAMSUNG | 0402 |