Filter Your Search
1 - 10 of 44,502 results
|
AP22802AW5-7
Diodes Incorporated
|
$0.1462 | Yes | Not Recommended | 5 V | 1 | LOAD SWITCH | 1 | R-PDSO-G5 | 1 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25, 5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | NO | 5.5 V | 2.7 V | ||||||||||||
![]() |
HTMS8001FTB/AF,115
NXP Semiconductors
|
$0.1716 | Yes | Active | CMOS | TELECOM CIRCUIT | Not Qualified | 1 | 260 | 3 | PLASTIC/EPOXY | QCCN | LCC3(UNSPEC) | CHIP CARRIER | YES | NO LEAD | QUAD | NXP SEMICONDUCTORS | compliant | NXP | SON | 3 | SOT1122 | ||||||||||||||||||||||||||
|
AP22802BW5-7
Diodes Incorporated
|
$0.1824 | Yes | Not Recommended | 5 V | 1 | LOAD SWITCH | 1 | R-PDSO-G5 | 85 °C | -40 °C | 260 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.4 mm | DIODES INC | SOT-25, 5 PIN | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | NO | 5.5 V | 2.7 V | ||||||||||||||
|
BGSA12UGL8E6327XTSA1
Infineon Technologies AG
|
$0.2648 | Yes | Active | TELECOM CIRCUIT | 1 | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | |||||||||||||||||||||||||||||||||||||||
|
AP22800HB-7
Diodes Incorporated
|
$0.2971 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N8 | e4 | 85 °C | -40 °C | 260 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.6 mm | 2.1 mm | 605 µm | DIODES INC | 2.10 X 1.60 MM, GREEN, DFN-8 | compliant | EAR99 | 8542.39.00.01 | Diodes Incorporated | |||||||||||||||||
|
BGSA11GN10E6327XTSA1
Infineon Technologies AG
|
$0.3038 | Yes | Active | 2.85 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B10 | 1 | 85 °C | -30 °C | 10 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | TSNP-10-1 | compliant | 8542.39.00.01 | Infineon | ||||||||||||||||||||
![]() |
SL2S5002FTB,115
NXP Semiconductors
|
$0.3128 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N3 | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 3 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 550 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT1122, XSON-3 | compliant | NXP | SON | 3 | SOT1122 | ||||||||||||||
![]() |
HT2MOA4S20/E/3/RJ
NXP Semiconductors
|
$0.3232 | Yes | Active | HYBRID | TELECOM CIRCUIT | e4 | Not Qualified | PLASTIC/EPOXY | MODULE(UNSPEC) | MICROELECTRONIC ASSEMBLY | Silver (Ag) | NXP SEMICONDUCTORS | compliant | NXP | COB | 35 | SOT500-2 | |||||||||||||||||||||||||||||||
![]() |
RF37S114HTFJB
Texas Instruments
|
$0.3347 | No | Active | TELECOM CIRCUIT | SEATED HT-CALCULATED | 1 | OTHER | S-XXMA-X | 1 | 70 °C | -25 °C | 260 | 30 | UNSPECIFIED | XMA | SQUARE | MICROELECTRONIC ASSEMBLY | YES | UNSPECIFIED | UNSPECIFIED | 4 mm | 4 mm | 760 µm | TEXAS INSTRUMENTS INC | MODULE | compliant | EAR99 | 8542.31.00.01 | Texas Instruments | |||||||||||||||||||
![]() |
SL3S1013FTB0,115
NXP Semiconductors
|
$0.3351 | Yes | Active | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 500 µm | DUAL | 1 mm | 1.45 mm | 500 µm | NXP SEMICONDUCTORS | 1.45 X 1 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT886F1, XSON-6 | compliant | 8542.32.00 | NXP | SON | 6 | SOT886 |