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61 - 70 of 44,461 results
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N24RF64DTPT3G
onsemi
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$0.9068 | Yes | Yes | Active | e4 | 1 | 260 | 30 | Nickel/Palladium/Gold (Ni/Pd/Au) | ONSEMI | TSSOP-8 | TSSOP-8 | 948AL | compliant | 8542.39.00.01 | onsemi | |||||||||||||||||||||||||||||
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MCP2122T-E/SN
Microchip Technology Inc
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$0.9224 | Yes | Yes | Active | TELECOM CIRCUIT | e3 | 1 | 260 | Matte Tin (Sn) | MICROCHIP TECHNOLOGY INC | SOIC | compliant | 8542.39.00.01 | Microchip | 8 | EAR99 | |||||||||||||||||||||||||||||
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HT2DC20S20/F/RSP
NXP Semiconductors
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$1.0000 | Yes | End Of Life | HYBRID | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PXSS-N | e4 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | PLASTIC/EPOXY | XSS | MODULE(UNSPEC) | RECTANGULAR | SPECIAL SHAPE | YES | Silver (Ag) | NO LEAD | UNSPECIFIED | NXP SEMICONDUCTORS | 12 X 6 MM, 3 MM HEIGHT, LEADLESS, PLASTIC, SOT-385-1, MODULE | SOT385-1 | compliant | NXP | PLCC | ||||||||||||||||
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MCP2140AT-I/SS
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-G20 | e3 | Not Qualified | 2 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 20 | PLASTIC/EPOXY | SSOP | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 5.3 mm | 7.2 mm | 2 mm | MICROCHIP TECHNOLOGY INC | SSOP | 209 INCH, PLASTIC, SSOP-20 | compliant | 8542.39.00.01 | Microchip | 20 | EAR99 | |||||
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USB3740B-AI2-TR
Microchip Technology Inc
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$1.0042 | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | 175 pA | INDUSTRIAL | R-PQCC-N10 | e4 | Not Qualified | 85 °C | -40 °C | TS 16949 | 10 | PLASTIC/EPOXY | VQCCN | LCC10,.06X.07,16 | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 400 µm | QUAD | 1.3 mm | 1.8 mm | 600 µm | MICROCHIP TECHNOLOGY INC | 1.80 X 1.30 MM, 0.55 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-10 | compliant | 8542.31.00.01 | Microchip | EAR99 | |||||||||||
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BGS15AN16E6327XTSA1
Infineon Technologies AG
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$1.0223 | Yes | Obsolete | 3.5 V | TELECOM CIRCUIT | 1 | OTHER | S-PQCC-N16 | e3 | 1 | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | TIN | NO LEAD | 500 µm | QUAD | 2.3 mm | 2.3 mm | 770 µm | INFINEON TECHNOLOGIES AG | TSNP-16 | compliant | 8542.39.00.01 | Infineon | |||||||||||||||
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OPA381AIDGKR
Texas Instruments
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$1.0559 | Yes | Yes | Active | 5 V | 1 | TELECOM CIRCUIT | 1 | AUTOMOTIVE | S-PDSO-G8 | e4 | Not Qualified | 2 | 125 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | GULL WING | 650 µm | DUAL | 3 mm | 3 mm | 1.1 mm | TEXAS INSTRUMENTS INC | MSOP | VSSOP-8 | compliant | 8542.33.00.01 | Texas Instruments | 8 | EAR99 | |||||||
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PN5120A0HN1/C2,151
NXP Semiconductors
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$1.0810 | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | OTHER | S-PQCC-N32 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | NXP SEMICONDUCTORS | QFN | 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-1, HVQFN-32 | SOT617-1 | compliant | NXP | 32 | ||||||||||||
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PN5120A0HN1/C1,151
NXP Semiconductors
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$1.0855 | Yes | Active | 3 V | TELECOM CIRCUIT | 1 | OTHER | S-PQCC-N32 | e4 | Not Qualified | 1 | 85 °C | -30 °C | 260 | 32 | PLASTIC/EPOXY | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | NXP SEMICONDUCTORS | QFN | 5 X 5 MM X 0.85 MM HEIGHT, PLASTIC, SOT-617, HVQFN-32 | SOT617-1 | compliant | 8542.39.00.01 | NXP | 32 | |||||||||
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TLE8457BLEXUMA1
Infineon Technologies AG
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$1.1010 | Yes | Active | 8 V | BICMOS | TELECOM CIRCUIT | 1 | S-PDSO-N8 | e3 | 2A | AEC-Q100 | 8 | PLASTIC/EPOXY | SON | SQUARE | SMALL OUTLINE | YES | Tin (Sn) | NO LEAD | 650 µm | DUAL | 3 mm | 3 mm | 1.15 mm | INFINEON TECHNOLOGIES AG | TSON-8 | compliant | 8542.39.00.01 | Infineon |