Parametric results for: at88rf04c-mr1g under Other Telecom ICs

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AP2280-2WG-7
Diodes Incorporated
$0.4327 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-G5 3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.45 mm DIODES INC SOT SOT-25, 5 PIN 5 compliant EAR99 8542.39.00.01 Diodes Incorporated NO 6 V 1.5 V
MAX7036GTP+
Maxim Integrated Products
$0.4339 Yes Yes Transferred 3.3 V CMOS TELECOM CIRCUIT 1 INDUSTRIAL S-XQCC-N20 e3 1 105 °C -40 °C 260 30 20 UNSPECIFIED HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 650 µm QUAD 5 mm 5 mm 800 µm MAXIM INTEGRATED PRODUCTS INC compliant EAR99 8542.39.00.01
AP2281-3FMG-7
Diodes Incorporated
$0.4405 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.81 mm 2 mm 605 µm DIODES INC DFN DFN-6 6 compliant EAR99 8542.39.00.01 Diodes Incorporated NO 6 V 1.5 V
AP2280-2FMG-7
Diodes Incorporated
$0.4406 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.8125 mm 2.0125 mm 605 µm DIODES INC DFN DFN-6 6 compliant EAR99 8542.39.00.01 Diodes Incorporated NO 6 V 1.5 V
BGA5M1BN6E6327XTSA1
Infineon Technologies AG
$0.4491 Yes Obsolete 1.8 V TELECOM CIRCUIT 1 INDUSTRIAL R-XBCC-B6 1 85 °C -40 °C 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant 8542.39.00.01 Infineon 2018-04-13
BGA8V1BN6E6327XTSA1
Infineon Technologies AG
$0.4603 Yes Not Recommended 2.8 V TELECOM CIRCUIT 1 INDUSTRIAL R-PDSO-N6 1 85 °C -40 °C 6 PLASTIC/EPOXY VSON RECTANGULAR SMALL OUTLINE, VERY THIN PROFILE YES NO LEAD 400 µm DUAL 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant 8542.39.00.01 Infineon
BGA5H1BN6E6327XTSA1
Infineon Technologies AG
$0.4613 Yes Not Recommended 1.8 V TELECOM CIRCUIT 1 INDUSTRIAL R-XBCC-B6 1 85 °C -40 °C 6 UNSPECIFIED BCC RECTANGULAR CHIP CARRIER YES BUTT 400 µm BOTTOM 700 µm 1.1 mm 400 µm INFINEON TECHNOLOGIES AG TSNP-6 compliant 8542.39.00.01 Infineon 2018-04-13
AP2280-1WG-7
Diodes Incorporated
$0.4910 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-G5 3 85 °C -40 °C 260 30 5 PLASTIC/EPOXY LSSOP TSOP5/6,.11,37 RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 950 µm DUAL 1.6 mm 3 mm 1.45 mm DIODES INC SOT SOT-25, 5 PIN 5 compliant EAR99 8542.39.00.01 Diodes Incorporated NO 6 V 1.5 V
AP2280-1FMG-7
Diodes Incorporated
$0.4953 Yes Yes Active 1.8 V 1 POWER SUPPLY SUPPORT CIRCUIT 1 R-PDSO-N6 1 85 °C -40 °C 260 30 6 PLASTIC/EPOXY HVSON SOLCC6,.07,20 RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES NICKEL PALLADIUM GOLD NO LEAD 500 µm DUAL 1.8125 mm 2.0125 mm 605 µm DIODES INC DFN DFN-6 6 compliant EAR99 8542.39.00.01 Diodes Incorporated NO 6 V 1.5 V
BGB707L7ESDE6327XTSA1
Infineon Technologies AG
$0.5208 Yes Active 3 V TELECOM CIRCUIT 1 R-PDSO-N7 e4 1 AEC-Q101 7 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Palladium/Gold (Pd/Au) NO LEAD 500 µm DUAL 1.3 mm 2 mm 500 µm INFINEON TECHNOLOGIES AG compliant EAR99 8542.33.00.01 Infineon