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1 - 10 of 4,434 results
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R9A06G061GNP#AA0
Renesas Electronics Corporation
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$3.5139 | Yes | No | Active | MODEM | RENESAS ELECTRONICS CORP | QFN | 40 | PVQN0040KK | unknown | Renesas Electronics | |||||||||||||||||||||||||||||||||||
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IAA110PTR
Littelfuse Inc
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$3.7950 | Yes | Active | MODEM-SUPPORT CIRCUIT | 1 | R-PDSO-G16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.493 mm | 10.16 mm | 2.159 mm | LITTELFUSE INC | compliant | LITTELFUSE | SOIC-16 | |||||||||||||||||||||
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DAC8742HPBSR
Texas Instruments
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$3.9702 | Yes | Yes | Active | 31 Mbps | PROGRAMMABLE MODEM | 1 | MILITARY | S-PQFP-G32 | e4 | 3 | 125 °C | -55 °C | 260 | 30 | 32 | PLASTIC/EPOXY | TFQFP | TQFP32,.28SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 500 µm | QUAD | 5 mm | 5 mm | 1.2 mm | TEXAS INSTRUMENTS INC | compliant | Texas Instruments | TQFP-32 | EAR99 | 8542.39.00.01 | 2017-12-16 | ||||||||||
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IAA110P
Littelfuse Inc
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$4.0227 | Yes | Active | MODEM-SUPPORT CIRCUIT | 1 | R-PDSO-G16 | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 7.493 mm | 10.16 mm | 2.159 mm | LITTELFUSE INC | compliant | SOIC-16 | ||||||||||||||||||||||
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TDA5051AT/C1,518
NXP Semiconductors
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$4.3831 | Yes | Active | 5 V | CMOS | MODEM | 68 µA | COMMERCIAL | R-PDSO-G16 | Not Qualified | 3 | 70 °C | 260 | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | NXP SEMICONDUCTORS | SOP | 16 | SOT162-1 | compliant | NXP | EAR99 | 8542.39.00.01 | |||||||||||||||
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DAC8741HRGET
Texas Instruments
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$4.5656 | Yes | Yes | Active | 31 Mbps | PROGRAMMABLE MODEM | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | TEXAS INSTRUMENTS INC | compliant | VQFN-24 | EAR99 | 8542.39.00.01 | ||||||||||||
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DAC8740HRGET
Texas Instruments
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$5.3896 | Yes | Yes | Active | 31 Mbps | PROGRAMMABLE MODEM | DIMENSION CAPTURED BASED ON LINK HTTP://WWW.TI.COM/LIT/DS/SBAS856C/SBAS856C.PDF | 1 | MILITARY | S-PQCC-N24 | e4 | 2 | 125 °C | -55 °C | 260 | 30 | 24 | PLASTIC/EPOXY | HVQCCN | LCC24,.15SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | NO LEAD | 500 µm | QUAD | 4 mm | 4 mm | 1 mm | TEXAS INSTRUMENTS INC | compliant | Texas Instruments | VQFN-24 | 2017-12-16 | |||||||||||
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DS8500-JND+
Maxim Integrated Products
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$8.4211 | Yes | Yes | Transferred | 1 Mbps | MODEM | 1 | 285 nA | INDUSTRIAL | S-XQCC-N20 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | LCC20,.20SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | QFN | 20 | compliant | 5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, TQFN-20 | EAR99 | 8542.39.00.01 | ||||||||
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LM1826N
Texas Instruments
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Check for Price | No | Obsolete | MODEM-DEMODULATOR | OTHER | R-PDIP-T18 | e0 | Not Qualified | 60 °C | -40 °C | 18 | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | NATIONAL SEMICONDUCTOR CORP | unknown | DIP, DIP18,.3 | 8542.39.00.01 | |||||||||||||||||||||
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SI2415-C-FSR
Silicon Laboratories Inc
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Check for Price | Yes | Yes | Transferred | 3.3 V | 14 Mbps | MODEM | 1 | COMMERCIAL | S-PDSO-G16 | Not Qualified | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 3.9 mm | 9.9 mm | 1.75 mm | SILICON LABORATORIES INC | SOIC | 16 | compliant | ROHS COMPLIANT, SOIC-16 | 8542.39.00.01 |