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21 - 30 of 4,341 results
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ZL50232QCG1
Microchip Technology Inc
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$135.5129 | Yes | Active | 1.8 V | ISDN ECHO CANCELLER | 1 | 250 µA | INDUSTRIAL | S-PQFP-G100 | e3 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MICROCHIP TECHNOLOGY INC | 14 X 14 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026BED, LQFP-100 | compliant | |||||||||||
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ZL50232GDG2
Microchip Technology Inc
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$135.5129 | Yes | Active | 1.8 V | ISDN ECHO CANCELLER | 1 | 250 µA | INDUSTRIAL | S-PBGA-B208 | e1 | Not Qualified | 85 °C | -40 °C | 208 | PLASTIC/EPOXY | LBGA | BGA208,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.5 mm | MICROCHIP TECHNOLOGY INC | 17 X 17 MM, 1.30 MM HEIGHT, LEAD FREE, MO-192, LBGA-208 | compliant | |||||||||||
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AM79C30AJC
Rochester Electronics LLC
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Check for Price | No | No | Active | 5 V | CMOS | DIGITAL SLIC | 1 | COMMERCIAL | S-PQCC-J44 | COMMERCIAL | NOT SPECIFIED | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | NOT SPECIFIED | J BEND | 1.27 mm | QUAD | 16.5862 mm | 16.5862 mm | 4.572 mm | ROCHESTER ELECTRONICS LLC | PLASTIC, LCC-44 | unknown | LCC | 44 | ||||||||
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MT91712ANR1
Microsemi Corporation
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Check for Price | Transferred | DIGITAL SLIC | MICROSEMI CORP | compliant | 8542.39.00.01 | |||||||||||||||||||||||||||||||||||
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DJLXT386LEB2
Intel Corporation
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Check for Price | Obsolete | 3.3 V | PCM TRANSCEIVER | 1 | INDUSTRIAL | S-PQFP-G100 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | INTEL CORP | LFQFP, | unknown | QFP | 100 | 8542.39.00.01 | |||||||||||||
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DS21Q348N
Dallas Semiconductor
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Check for Price | No | Transferred | 3.3 V | PCM TRANSCEIVER | 1 | 100 µA | INDUSTRIAL | S-PBGA-B144 | e0 | Not Qualified | 85 °C | -40 °C | 144 | PLASTIC/EPOXY | BGA | BGA144,12X12,50 | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | 1.27 mm | BOTTOM | DALLAS SEMICONDUCTOR | BGA-144 | unknown | ||||||||||||||
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PSB2170
Intel Corporation
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Check for Price | Contact Manufacturer | 3.3 V | CMOS | ISDN ECHO CANCELLER | 1 | COMMERCIAL | S-PQFP-G80 | Not Qualified | 70 °C | 80 | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | YES | GULL WING | 650 µm | QUAD | 14 mm | 14 mm | 2.45 mm | INTEL CORP | QFP, | compliant | 8542.39.00.01 | |||||||||||||||
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IDT82V2044EPFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 3.3 V | PCM TRANSCEIVER | 1 | INDUSTRIAL | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 128 | PLASTIC/EPOXY | LFQFP | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | YES | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | GREEN, TQFP-128 | compliant | QFP | 128 | 8542.39.00.01 | EAR99 | |||||
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FLLXT3108BE.B3
Cortina Systems Inc
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Check for Price | No | Obsolete | 3.3 V | 10 nA | INDUSTRIAL | S-PBGA-B256 | Not Qualified | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | CORTINA SYSTEMS INC | BGA, BGA256,16X16,40 | unknown | 8542.39.00.01 | |||||||||||||||||
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S29C304A
Temic Semiconductors
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Check for Price | Transferred | 5 V | PCM TRANSCEIVER | 1 | S-PQCC-J28 | Not Qualified | 28 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | J BEND | QUAD | TEMIC SEMICONDUCTORS | unknown |