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DS2154L
Maxim Integrated Products
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$3.2639 | No | No | Obsolete | 5 V | CMOS | CEPT PCM-30/E-1 | FRAMER | 1 | COMMERCIAL | S-PQFP-G100 | e0 | Not Qualified | 3 | 70 °C | 240 | 20 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100 | 100 | not_compliant | EAR99 | 8542.39.00.01 | ||||||||
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PM4351-RGI
Microchip Technology Inc
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$27.9441 | Yes | Active | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B81 | e3 | 85 °C | -40 °C | 81 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | MATTE TIN | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | CABGA-81 | compliant | 5A991.B | 8542.31.00.01 | Microchip | |||||||||||||||||||
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82V2108PXG
Integrated Device Technology Inc
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$38.2973 | Yes | Yes | Transferred | 3.3 V | CMOS | FRAMER | 1 | INDUSTRIAL | R-PQFP-G128 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 128 | PLASTIC/EPOXY | FQFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 20 mm | 3.4 mm | INTEGRATED DEVICE TECHNOLOGY INC | PQFP | GREEN, PLASTIC, QFP-128 | 128 | compliant | EAR99 | 8542.39.00.01 | PXG128 | |||||||
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PM4358-NGI
Microchip Technology Inc
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$42.8457 | Yes | Active | 1.8 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PBGA-B256 | 3 | 85 °C | -40 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | CABGA-256 | compliant | 5A991.B | 8542.31.00.01 | Microchip | ||||||||||||||||||||
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DS26518GN+
Analog Devices Inc
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$49.0195 | Yes | Not Recommended | 1.8 V | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | 450 mA | INDUSTRIAL | S-PBGA-B256 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | ANALOG DEVICES INC | 256-CSP_BGA-17X17X1.26 | 17 X 17 MM, 1 MM, PITCH, ROHS COMPLIANT, TECSBGA-256 | 256 | compliant | Analog Devices | 256-CSP_BGA-17X17X1.26 | 2007-02-28 | ||||||||
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DS34T108GN+
Maxim Integrated Products
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$109.5445 | Yes | Yes | Transferred | 1.8 V | FRAMER | 1 | 550 µA | INDUSTRIAL | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 23 X 23 MM, ROHS COMPLIANT, HSBGA-484 | 484 | compliant | EAR99 | 8542.39.00.01 | ||||||||
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PM8318-FXI
Microchip Technology Inc
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$485.4540 | Active | CMOS | FRAMER | 1 | S-PBGA-B480 | 480 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 3.32 mm | MICROCHIP TECHNOLOGY INC | BBGA-480 | compliant | 5A991.B | 8542.31.00.01 | |||||||||||||||||||||||
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PM8310A-FEI
Microchip Technology Inc
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$791.6142 | Yes | Active | FRAMER | 1 | INDUSTRIAL | S-PBGA-B896 | 85 °C | -40 °C | 896 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 31 mm | 31 mm | 2.24 mm | MICROCHIP TECHNOLOGY INC | HBBGA-896 | compliant | Microchip | |||||||||||||||||||||
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PM5326-FEI
Microchip Technology Inc
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$1,035.9586 | Obsolete | 1.2 V | FRAMER | 1 | S-PBGA-B1292 | 1292 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | BOTTOM | MICROCHIP TECHNOLOGY INC | FCBGA-1292 | compliant | 5A991.B | 8542.31.00.01 | |||||||||||||||||||||||||||
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MT9074AP
Microsemi Corporation
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Check for Price | No | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 200 mA | INDUSTRIAL | S-PQCC-J68 | e0 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 24.23 mm | 24.23 mm | 4.57 mm | MICROSEMI CORP | LCC | PLASTIC, MS-018AE, LCC-68 | 68 | unknown | 8542.39.00.01 |