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DS2155GN+
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3.3 V | FRAMER | 1 | INDUSTRIAL | S-PBGA-B100 | e1 | Not Qualified | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 10 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, CSBGA-100 | 100 | compliant | 8542.39.00.01 | |||||||||
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L-T-8105---SC4-DB
LSI Corporation
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Check for Price | Yes | Yes | Transferred | 3.3 V | TIME SLOT ASSIGNER | 1 | 275 µA | COMMERCIAL | S-PQFP-G208 | e6 | Not Qualified | 70 °C | 208 | PLASTIC/EPOXY | FQFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | YES | TIN BISMUTH | GULL WING | 500 µm | QUAD | 28 mm | 28 mm | 4.1 mm | LSI CORP | QFP | FQFP, QFP208,1.2SQ,20 | 208 | compliant | 8542.39.00.01 | |||||||
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CX28395-19
Conexant Systems Inc
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Check for Price | No | Obsolete | 3.3 V | CMOS | FRAMER | 16 | 310 mA | INDUSTRIAL | S-PBGA-B318 | Not Qualified | 1 | 85 °C | -40 °C | 318 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.44 mm | CONEXANT SYSTEMS | BGA | BGA, | 318 | compliant | 8542.39.00.01 | ||||||||
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PEF22554HT
Intel Corporation
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Check for Price | Yes | Contact Manufacturer | 1.8 V | FRAMER | 1 | 230 mA | INDUSTRIAL | S-PBGA-B160 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 160 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 15 mm | 15 mm | 1.6 mm | INTEL CORP | GREEN, PLASTIC, LBGA-160 | compliant | 8542.39.00.01 | ||||||||||
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TSS933EBSC
Atmel Corporation
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Check for Price | Obsolete | 5 V | BICMOS | FRAMER | 1 | MILITARY | S-CQCC-N28 | Not Qualified | 125 °C | -55 °C | 28 | CERAMIC, METAL-SEALED COFIRED | QCCN | SQUARE | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 11.49 mm | 11.49 mm | 2.03 mm | ATMEL CORP | QLCC | QCCN, | 28 | unknown | 8542.39.00.01 | |||||||||||
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BT8071AEPJ
Conexant Systems Inc
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PQCC-J68 | e0 | Not Qualified | 85 °C | -40 °C | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 25.145 mm | 25.145 mm | 5.08 mm | BROOKTREE CORP | QCCJ, LDCC68,1.0SQ | unknown | 8542.39.00.01 | |||||||||
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TFRA84J131BL-3
LSI Corporation
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Check for Price | No | No | Transferred | 1.5 V | FRAMER | 1 | INDUSTRIAL | S-PBGA-B909 | Not Qualified | 2A | 85 °C | -40 °C | 909 | PLASTIC/EPOXY | BGA | BGA909,34X34,40 | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 35 mm | 35 mm | 2.51 mm | AGERE SYSTEMS INC | BGA | BGA, BGA909,34X34,40 | 909 | unknown | 8542.39.00.01 | ||||||||
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DS2141AQN
Maxim Integrated Products
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | INDUSTRIAL | S-PQCC-J44 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MAXIM INTEGRATED PRODUCTS INC | PLASTIC, LCC-44 | compliant | |||||||||
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T8105---BAL-DB
Broadcom Limited
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Check for Price | Active | 3.3 V | TIME SLOT ASSIGNER | 1 | 275 mA | INDUSTRIAL | S-PBGA-B217 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 217 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1.27 mm | BOTTOM | 23 mm | 23 mm | 2.32 mm | BROADCOM INC | PLASTIC, BGA-217 | compliant | 8542.39.00.01 | |||||||||
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DS21FT44
Rochester Electronics LLC
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Check for Price | No | No | Active | 3.3 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PBGA-B300 | COMMERCIAL | 4 | 70 °C | 240 | 20 | 300 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | NOT SPECIFIED | BALL | 1.27 mm | BOTTOM | 27 mm | 27 mm | 2.54 mm | ROCHESTER ELECTRONICS INC | BGA | BGA, | 300 | unknown |