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RS8953SPBEPF
Conexant Systems Inc
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Check for Price Buy | No | No | Obsolete | 3.3 V | CMOS | 1.168 Gbps | FRAMER | 1 | 21.1 mA | INDUSTRIAL | R-PQFP-G80 | e0 | Not Qualified | 85 °C | -40 °C | 80 | PLASTIC/EPOXY | QFP | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 14 mm | 20 mm | 3.1 mm | CONEXANT SYSTEMS | QFP | QFP-80 | 80 | compliant | 8542.39.00.01 | ||||||||
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KT8555
Samsung Semiconductor
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Check for Price Buy | Obsolete | 5 V | TIME SLOT ASSIGNER | 1 | 1.5 mA | R-GDIP-T20 | Not Qualified | 20 | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 25.855 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, | 20 | unknown | 8542.39.00.01 | ||||||||||||||||||
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PT7A6527JE
Pericom Semiconductor Corporation
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Check for Price Buy | Yes | Obsolete | PERICOM SEMICONDUCTOR CORP | LCC | QCCJ, | 44 | compliant | 8542.39.00.01 | EAR99 | ||||||||||||||||||||||||||||||||||
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MH89790B1
Microsemi Corporation
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Check for Price Buy | Yes | Yes | Obsolete | 5 V | FRAMER | 1 | 45 mA | COMMERCIAL | R-PDIP-T40 | e3 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 33 mm | 50.8 mm | ZARLINK SEMICONDUCTOR INC | DIP | DIP, | 40 | compliant | 8542.39.00.01 | |||||||||||||
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DS2152LN
Maxim Integrated Products
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Check for Price Buy | No | Obsolete | 5 V | CMOS | T-1(DS1) | FRAMER | 1 | INDUSTRIAL | S-PQFP-G100 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100 | 100 | not_compliant | 8542.39.00.01 | EAR99 | ||||||||
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BT8200
Conexant Systems Inc
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Check for Price Buy | No | Transferred | 5 V | FRAMER | INDUSTRIAL | S-PQCC-J84 | e0 | Not Qualified | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | CONEXANT SYSTEMS | LCC | QCCJ, LDCC84,1.2SQ | 84 | compliant | 8542.39.00.01 | ||||||||||||||||
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TTSI004161BL-2
Avago Technologies
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Check for Price Buy | Active | 1.5 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B240 | e0 | Not Qualified | 85 °C | -40 °C | 225 | 30 | 240 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 19 mm | 19 mm | 2.07 mm | AVAGO TECHNOLOGIES INC | BGA, | unknown | 8542.39.00.01 | ||||||||||||||
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PEB2035A3P
Infineon Technologies AG
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Check for Price Buy | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 18 mA | COMMERCIAL | R-PDIP-T40 | e0 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INFINEON TECHNOLOGIES AG | not_compliant | 8542.39.00.01 | |||||||||||||||||
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DS2155GN
Maxim Integrated Products
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Check for Price Buy | No | No | Obsolete | 3.3 V | CEPT PCM-30/E-1 | FRAMER | T-1(DS1) | 1 | INDUSTRIAL | S-PBGA-B100 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | FBGA | QFP100,.63SQ,20 | SQUARE | GRID ARRAY, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 10 mm | 10 mm | 1.41 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 10 X 10 MM, 0.80 MM PITCH, CSBGA-100 | 100 | compliant | 8542.39.00.01 | EAR99 | |||||||
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MH89790BN
Microsemi Corporation
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Check for Price Buy | No | No | Obsolete | 5 V | HYBRID | FRAMER | 1 | 45 mA | COMMERCIAL | R-PDIP-T40 | e0 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.8 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 20.32 mm | 50.8 mm | 6.35 mm | MITEL SEMICONDUCTOR | DIP | DIP, DIP40,.8 | 40 | unknown | 8542.39.00.01 |