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TTSI016641BL-1
LSI Corporation
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Check for Price | No | Transferred | 1.5 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PBGA-B324 | Not Qualified | 85 °C | -40 °C | 324 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.51 mm | AGERE SYSTEMS INC | BGA | BGA, | 324 | unknown | 8542.39.00.01 | |||||||||||||||
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MH89790BN
Microsemi Corporation
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Check for Price | No | No | Obsolete | 5 V | HYBRID | FRAMER | 1 | 45 mA | COMMERCIAL | R-PDIP-T40 | e0 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.8 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 20.32 mm | 50.8 mm | 6.35 mm | MITEL SEMICONDUCTOR | DIP | DIP, DIP40,.8 | 40 | unknown | 8542.39.00.01 | ||||||||||
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TP3155N/NOPB
Texas Instruments
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Check for Price | Yes | Obsolete | 5 V | CMOS | TIME SLOT ASSIGNER | 1 | 1.5 mA | COMMERCIAL | R-PDIP-T20 | e3 | Not Qualified | 1 | 70 °C | 260 | 40 | 20 | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 26.075 mm | 5.08 mm | NATIONAL SEMICONDUCTOR CORP | DIP, DIP20,.3 | compliant | 8542.39.00.01 | ||||||||||
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ML53612
OKI Electric Industry Co Ltd
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Check for Price | Transferred | 3.3 V | TIME SLOT ASSIGNER | 1 | INDUSTRIAL | S-PQFP-G176 | Not Qualified | 85 °C | -40 °C | 176 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 24 mm | 24 mm | 1.7 mm | OKI ELECTRIC INDUSTRY CO LTD | QFP | LFQFP, | 176 | unknown | 8542.39.00.01 | ||||||||||||||||
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DS3134
Dallas Semiconductor
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Check for Price | No | Transferred | 3.3 V | CMOS | FRAMER | 1 | COMMERCIAL | S-PBGA-B256 | e0 | Not Qualified | 70 °C | 256 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | YES | Tin/Lead (Sn/Pb) | BALL | BOTTOM | DALLAS SEMICONDUCTOR | 27 X 27 MM, PLASTIC, BGA-256 | unknown | ||||||||||||||||||||
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DS2152LN
Maxim Integrated Products
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Check for Price | No | Obsolete | 5 V | CMOS | T-1(DS1) | FRAMER | 1 | INDUSTRIAL | S-PQFP-G100 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | MAXIM INTEGRATED PRODUCTS INC | QFP | 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100 | 100 | not_compliant | 8542.39.00.01 | EAR99 | ||||||||
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DS26519GN+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 1.8 V | CEPT PCM-30/E-1 | FRAMER | 1 | 925 mA | INDUSTRIAL | S-PBGA-B484 | e1 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 484 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 23 mm | 23 mm | 2.41 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, HSBGA-484 | 484 | compliant | 8542.39.00.01 | EAR99 | |||||
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TSS933EBM883
Temic Semiconductors
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Check for Price | No | Transferred | 5 V | BICMOS | FRAMER | 1 | MILITARY | S-XQCC-J28 | e0 | Not Qualified | 125 °C | -55 °C | 38535Q/M;38534H;883B | 28 | UNSPECIFIED | QCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | J BEND | 1.27 mm | QUAD | TEMIC SEMICONDUCTORS | LCC-28 | unknown | ||||||||||||||||
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PEB2035A3P
Infineon Technologies AG
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Check for Price | No | Obsolete | 5 V | CMOS | FRAMER | 1 | 18 mA | COMMERCIAL | R-PDIP-T40 | e0 | Not Qualified | 70 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | INFINEON TECHNOLOGIES AG | not_compliant | 8542.39.00.01 | |||||||||||||||||
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DS26524G+
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 3.3 V | BIPOLAR | CEPT PCM-30/E-1 | TIME SLOT 0/16 TRANSCEIVER | T-1(DS1) | 1 | 450 µA | COMMERCIAL | S-PBGA-B256 | e1 | Not Qualified | 3 | 70 °C | 256 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 17 mm | 17 mm | 1.76 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, TE-CSBGA-256 | 256 | compliant | 8542.39.00.01 | EAR99 |