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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: MC13110AFB under Cordless Telephone ICs

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U3600BM-NFNG3
 Atmel Corporation 		Check for Price No Obsolete 3.6 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 29 mA COMMERCIAL EXTENDED R-PDSO-G44 e0 Not Qualified 75 °C -25 °C 44 PLASTIC/EPOXY SSOP SOP44,.4,32 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 800 µm DUAL 7.4 mm 17.925 mm 2.6 mm ATMEL CORP SOIC SSOP, SOP44,.4,32 44 unknown 8542.39.00.01
NCL354TMX
 National Semiconductor Corporation 		Check for Price Obsolete 3.3 V CMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL EXTENDED R-PDSO-G56 Not Qualified 80 °C -30 °C 56 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 500 µm DUAL 6.1 mm 14 mm 1.1 mm NATIONAL SEMICONDUCTOR CORP TSSOP, unknown 8542.39.00.01
SC14404BFLAG
 Texas Instruments 		Check for Price Obsolete CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 Not Qualified 100 PLASTIC/EPOXY FQFP QFP100,.63SQ,20 SQUARE FLATPACK, FINE PITCH YES GULL WING 500 µm QUAD 14 mm 14 mm 1.758 mm NATIONAL SEMICONDUCTOR CORP FQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
CT914H
 NXP Semiconductors 		Check for Price Active CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 X-XXMA-X Not Qualified UNSPECIFIED XMA UNSPECIFIED MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED NXP SEMICONDUCTORS , unknown 8542.39.00.01
TA31132FN-TP1
 Toshiba America Electronic Components 		Check for Price No No Active 3.5 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 5 mA OTHER R-PDSO-G24 e0 Not Qualified 85 °C -30 °C 24 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 5.6 mm 7.8 mm 1.6 mm TOSHIBA CORP SSOP LSSOP, 24 unknown 8542.39.00.01
KS8803B
 Samsung Semiconductor 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDIP-T16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.4 mm 5.08 mm SAMSUNG SEMICONDUCTOR INC DIP DIP, DIP16,.3 16 compliant 8542.39.00.01
MSM7586-01TS-K
 LAPIS Semiconductor Co Ltd 		Check for Price Obsolete 3 V CMOS 384 Mbps MODEM 1 28 mA OTHER S-PQFP-G100 Not Qualified 70 °C -25 °C 100 PLASTIC/EPOXY QFP TQFP100,.63SQ SQUARE FLATPACK YES GULL WING 500 µm QUAD LAPIS SEMICONDUCTOR CO LTD QFP, TQFP100,.63SQ unknown 8542.39.00.01
TEA1118AT
 Philips Semiconductors 		Check for Price No Transferred 2.9 V BIPOLAR 1.4 mA OTHER R-PDSO-G14 e0 Not Qualified 70 °C -25 °C 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL PHILIPS SEMICONDUCTORS SOP, SOP14,.25 unknown 8542.39.00.01
TA31136FN-TP1
 Toshiba America Electronic Components 		Check for Price Active 2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 4.6 mA OTHER R-PDSO-G16 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5 mm 1.6 mm TOSHIBA CORP SOIC LSSOP, 16 unknown 8542.39.00.01
AD6190ARS
 Analog Devices Inc 		Check for Price No Obsolete 3.3 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -20 °C 28 PLASTIC/EPOXY SSOP SSOP28,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES Tin/Lead (Sn/Pb) GULL WING 650 µm DUAL 5.3 mm 10.2 mm 2 mm ANALOG DEVICES INC SSOP SSOP-28 28 unknown 8542.39.00.01
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