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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: U2760B-AFS under Cordless Telephone ICs

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TEA1118T
 Philips Semiconductors 		Check for Price No Transferred 2.9 V BIPOLAR 1.4 mA OTHER R-PDSO-G14 e0 Not Qualified 70 °C -25 °C 14 PLASTIC/EPOXY SOP SOP14,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL PHILIPS SEMICONDUCTORS SOP, SOP14,.25 unknown 8542.39.00.01
MC33411AFTA
 NXP Semiconductors 		Check for Price Obsolete CORDLESS TELEPHONE BASEBAND CIRCUIT NXP SEMICONDUCTORS unknown
935237440118
 NXP Semiconductors 		Check for Price Obsolete 2.9 V BIPOLAR CORDLESS TELEPHONE BASEBAND CIRCUIT 1 1.4 mA COMMERCIAL EXTENDED R-PDSO-G16 Not Qualified 75 °C -25 °C 16 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5.2 mm 1.5 mm NXP SEMICONDUCTORS LSSOP, unknown 8542.39.00.01 SOIC 16
U2761B
 Atmel Corporation 		Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -25 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 9.055 mm 1.45 mm ATMEL CORP SSOP, SSOP28,.25 unknown 8542.39.00.01 SOIC 28
S1T8527C01-Q0R0
 Samsung Semiconductor 		Check for Price Obsolete 3.6 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 7.5 mA COMMERCIAL S-PQFP-G48 Not Qualified 70 °C -20 °C 48 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 750 µm QUAD 10 mm 10 mm 2.3 mm SAMSUNG SEMICONDUCTOR INC QFP, unknown 8542.39.00.01 QFP 48
KS8803BD
 Samsung Semiconductor 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDSO-G16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3.95 mm 9.9 mm 1.95 mm SAMSUNG SEMICONDUCTOR INC SOP, SOP16,.25 compliant 8542.39.00.01 SOIC 16
UBA1706TS
 NXP Semiconductors 		Check for Price Obsolete 3.3 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 3.2 µA COMMERCIAL EXTENDED R-PDSO-G24 e4 Not Qualified 75 °C -25 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm NXP SEMICONDUCTORS SSOP, SSOP24,.3 compliant 8542.39.00.01 SSOP 24
TB31262F
 Toshiba America Electronic Components 		Check for Price No No Active 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 84 mA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOSHIBA CORP QFP, unknown 8542.39.00.01 QFP 52
Z87L0116ASG
 Zilog Inc 		Check for Price Yes Transferred 3.3 V CMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 55 mA COMMERCIAL S-PQFP-G144 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 20 mm 20 mm 1.6 mm ZILOG INC LFQFP, unknown 8542.39.00.01 QFP 144 Cordless Telephone Support Circuit
CT914H
 NXP Semiconductors 		Check for Price Active CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 X-XXMA-X Not Qualified UNSPECIFIED XMA UNSPECIFIED MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED NXP SEMICONDUCTORS , unknown 8542.39.00.01
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