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KS8803B
Samsung Semiconductor
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 7 µA | COMMERCIAL EXTENDED | R-PDIP-T16 | e0 | Not Qualified | 75 °C | -30 °C | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | NO | TIN LEAD | THROUGH-HOLE | 2.54 mm | DUAL | 7.62 mm | 19.4 mm | 5.08 mm | SAMSUNG SEMICONDUCTOR INC | DIP | DIP, DIP16,.3 | 16 | compliant | 8542.39.00.01 | ||||||
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SC14405AXXAG
National Semiconductor Corporation
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Check for Price | Obsolete | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | S-PQFP-G100 | Not Qualified | 100 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | NATIONAL SEMICONDUCTOR CORP | LFQFP, | unknown | 8542.39.00.01 | |||||||||||||||||
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MSM7586-01TS-K
LAPIS Semiconductor Co Ltd
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Check for Price | Obsolete | 3 V | CMOS | 384 Mbps | MODEM | 1 | 28 mA | OTHER | S-PQFP-G100 | Not Qualified | 70 °C | -25 °C | 100 | PLASTIC/EPOXY | QFP | TQFP100,.63SQ | SQUARE | FLATPACK | YES | GULL WING | 500 µm | QUAD | LAPIS SEMICONDUCTOR CO LTD | QFP, TQFP100,.63SQ | unknown | 8542.39.00.01 | |||||||||||||
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TEA1118AT
Philips Semiconductors
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Check for Price | No | Transferred | 2.9 V | BIPOLAR | 1.4 mA | OTHER | R-PDSO-G14 | e0 | Not Qualified | 70 °C | -25 °C | 14 | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | PHILIPS SEMICONDUCTORS | SOP, SOP14,.25 | unknown | 8542.39.00.01 | |||||||||||||
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BU8242FT1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8 mA | R-PDSO-G20 | e3/e2 | Not Qualified | 260 | 10 | 20 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | TIN/TIN COPPER | GULL WING | 1.27 mm | DUAL | 5.4 mm | 12.5 mm | 1.9 mm | ROHM CO LTD | SOIC | SOP-20 | 20 | compliant | 8542.39.00.01 | ||||||||
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935277007112
NXP Semiconductors
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Check for Price | Obsolete | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 8.5 mA | INDUSTRIAL | R-PDSO-G20 | 85 °C | -40 °C | 20 | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 6.5 mm | 1.5 mm | NXP SEMICONDUCTORS | LSSOP, | unknown | 8542.39.00.01 | ||||||||||||||
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TA31136F
Toshiba America Electronic Components
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Check for Price | Obsolete | 2 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 4.6 mA | OTHER | R-PDSO-G16 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | TOSHIBA CORP | SOIC | SSOP, | 16 | unknown | 8542.39.00.01 | ||||||||||
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U2762B-BFS
Telefunken Microelectronics Gmbh
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Check for Price | No | Transferred | 2.9 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | COMMERCIAL | R-PDSO-G28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | TELEFUNKEN MICROELECTRONICS GMBH | unknown | 8542.39.00.01 | |||||||||||||||
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SM5132DS
Seiko NPC Corporation
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Check for Price | No | Obsolete | 5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | COMMERCIAL EXTENDED | R-PDSO-G16 | Not Qualified | 80 °C | -30 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 4.4 mm | 10.2 mm | 1.7 mm | SEIKO NPC CORP | SOP, SOP16,.25 | unknown | 8542.39.00.01 | ||||||||||
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TA31102F(ER)
Toshiba America Electronic Components
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Check for Price | No | No | Active | 5 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 6 mA | OTHER | R-PDSO-G16 | e0 | Not Qualified | 85 °C | -30 °C | 16 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 1 mm | DUAL | 4.6 mm | 8.2 mm | 1.9 mm | TOSHIBA CORP | SOIC | SSOP, | 16 | unknown | 8542.39.00.01 |