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11 - 20 of 773 results
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KS8800D
Samsung Semiconductor
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Check for Price | No | Obsolete | 4.5 V | CMOS | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 15 mA | OTHER | R-PDSO-G18 | e0 | Not Qualified | 70 °C | -25 °C | 18 | PLASTIC/EPOXY | SOP | SOP18,.3 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 1.27 mm | DUAL | SAMSUNG SEMICONDUCTOR INC | SOP, SOP18,.3 | unknown | 8542.39.00.01 | ||||||||||
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UA31136G-P16-R
Unisonic Technologies Co Ltd
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Check for Price | Yes | Active | 2 V | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | R-PDSO-G16 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 4.4 mm | 5.075 mm | 1.2 mm | UNISONIC TECHNOLOGIES CO LTD | HALOGEN FREE, TSSOP-16 | compliant | 8542.39.00.01 | TSSOP | 16 | |||||||||
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U2762B-BFSG3
Temic Semiconductors
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Check for Price | No | Transferred | 2.9 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | COMMERCIAL | R-PDSO-G28 | e0 | Not Qualified | 70 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.25 | RECTANGULAR | SMALL OUTLINE | YES | Tin/Lead (Sn/Pb) | GULL WING | 635 µm | DUAL | TEMIC SEMICONDUCTORS | SSO-28 | unknown | |||||||||||||
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U3600BM-MFN
Atmel Corporation
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Check for Price | Obsolete | 3.6 V | BIPOLAR | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 29 mA | COMMERCIAL EXTENDED | R-PDSO-G44 | Not Qualified | 75 °C | -25 °C | 44 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | GULL WING | 800 µm | DUAL | 7.4 mm | 17.925 mm | 2.6 mm | ATMEL CORP | SSOP, | unknown | 8542.39.00.01 | SOIC | 44 | |||||||||
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UPC8139GR-7JH
NEC Electronics Group
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Check for Price | No | Obsolete | 3 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | 49 mA | COMMERCIAL EXTENDED | R-PDSO-G30 | e0 | Not Qualified | 80 °C | -30 °C | 30 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN LEAD | GULL WING | 500 µm | DUAL | 4.4 mm | 7.8 mm | 1.2 mm | NEC ELECTRONICS CORP | TSSOP, | compliant | 8542.39.00.01 | TSSOP | 30 | ||||||
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U7006B-MLBG3
Temic Semiconductors
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Check for Price | Transferred | 3 V | BIPOLAR | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | OTHER | R-PDSO-G16 | Not Qualified | 70 °C | -25 °C | 16 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | DUAL | TEMIC SEMICONDUCTORS | PLASTIC, SSO-16 | unknown | |||||||||||||||||
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ML5800SK-03
RF Micro Devices Inc
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Check for Price | Obsolete | 3.3 V | CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT | 1 | 90 mA | COMMERCIAL | S-PQCC-N32 | e3 | Not Qualified | 60 °C | -10 °C | 32 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 500 µm | QUAD | 5 mm | 5 mm | 1 mm | RF MICRO DEVICES INC | HVQCCN, | unknown | 8542.39.00.01 | QFN | 32 | ||||||||
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HHM0130
TDK Corporation
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Check for Price | Obsolete | CORDLESS TELEPHONE SUPPORT CIRCUIT | 1 | COMMERCIAL | R-PDMW-N6 | Not Qualified | 60 °C | -10 °C | 6 | PLASTIC/EPOXY | SON | RECTANGULAR | SMALL OUTLINE | YES | NO LEAD | 800 µm | DUAL | 4 mm | 4.8 mm | 1.4 mm | TDK CORP | , | unknown | 8542.39.00.01 | ||||||||||||||
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SC14402DVJG
Texas Instruments
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Check for Price | No | Obsolete | 3 V | CMOS | CORDLESS TELEPHONE BASEBAND CIRCUIT | 1 | S-PQFP-G100 | e0 | Not Qualified | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN LEAD | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | NATIONAL SEMICONDUCTOR CORP | LFQFP, QFP100,.63SQ,20 | unknown | 8542.39.00.01 | |||||||||||
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BU8241FS-T1
ROHM Semiconductor
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Check for Price | Yes | Yes | Active | SUPPORT CIRCUIT | 1 | R-PDSO-G24 | e3/e2 | Not Qualified | 260 | 10 | 24 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 800 µm | DUAL | 5.4 mm | 10 mm | 2.01 mm | ROHM CO LTD | SSOP-24 | unknown | SSOP | 24 |