Parametric results for: U2760B-AFS under Cordless Telephone ICs

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KS8800D
Samsung Semiconductor
Check for Price No Obsolete 4.5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 15 mA OTHER R-PDSO-G18 e0 Not Qualified 70 °C -25 °C 18 PLASTIC/EPOXY SOP SOP18,.3 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL SAMSUNG SEMICONDUCTOR INC SOP, SOP18,.3 unknown 8542.39.00.01
UA31136G-P16-R
Unisonic Technologies Co Ltd
Check for Price Yes Active 2 V CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G16 85 °C -30 °C NOT SPECIFIED NOT SPECIFIED 16 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5.075 mm 1.2 mm UNISONIC TECHNOLOGIES CO LTD HALOGEN FREE, TSSOP-16 compliant 8542.39.00.01 TSSOP 16
U2762B-BFSG3
Temic Semiconductors
Check for Price No Transferred 2.9 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 COMMERCIAL R-PDSO-G28 e0 Not Qualified 70 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 635 µm DUAL TEMIC SEMICONDUCTORS SSO-28 unknown
U3600BM-MFN
Atmel Corporation
Check for Price Obsolete 3.6 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 29 mA COMMERCIAL EXTENDED R-PDSO-G44 Not Qualified 75 °C -25 °C 44 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 800 µm DUAL 7.4 mm 17.925 mm 2.6 mm ATMEL CORP SSOP, unknown 8542.39.00.01 SOIC 44
UPC8139GR-7JH
NEC Electronics Group
Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 49 mA COMMERCIAL EXTENDED R-PDSO-G30 e0 Not Qualified 80 °C -30 °C 30 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 4.4 mm 7.8 mm 1.2 mm NEC ELECTRONICS CORP TSSOP, compliant 8542.39.00.01 TSSOP 30
U7006B-MLBG3
Temic Semiconductors
Check for Price Transferred 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER R-PDSO-G16 Not Qualified 70 °C -25 °C 16 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING DUAL TEMIC SEMICONDUCTORS PLASTIC, SSO-16 unknown
ML5800SK-03
RF Micro Devices Inc
Check for Price Obsolete 3.3 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 90 mA COMMERCIAL S-PQCC-N32 e3 Not Qualified 60 °C -10 °C 32 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 5 mm 5 mm 1 mm RF MICRO DEVICES INC HVQCCN, unknown 8542.39.00.01 QFN 32
HHM0130
TDK Corporation
Check for Price Obsolete CORDLESS TELEPHONE SUPPORT CIRCUIT 1 COMMERCIAL R-PDMW-N6 Not Qualified 60 °C -10 °C 6 PLASTIC/EPOXY SON RECTANGULAR SMALL OUTLINE YES NO LEAD 800 µm DUAL 4 mm 4.8 mm 1.4 mm TDK CORP , unknown 8542.39.00.01
SC14402DVJG
Texas Instruments
Check for Price No Obsolete 3 V CMOS CORDLESS TELEPHONE BASEBAND CIRCUIT 1 S-PQFP-G100 e0 Not Qualified 100 PLASTIC/EPOXY LFQFP QFP100,.63SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES TIN LEAD GULL WING 500 µm QUAD 14 mm 14 mm 1.6 mm NATIONAL SEMICONDUCTOR CORP LFQFP, QFP100,.63SQ,20 unknown 8542.39.00.01
BU8241FS-T1
ROHM Semiconductor
Check for Price Yes Yes Active SUPPORT CIRCUIT 1 R-PDSO-G24 e3/e2 Not Qualified 260 10 24 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN/TIN COPPER GULL WING 800 µm DUAL 5.4 mm 10 mm 2.01 mm ROHM CO LTD SSOP-24 unknown SSOP 24