Parametric results for: DS1135LZ-20/T&R under Delay Lines

BOTH LEADING & TRAILING EDGE ACCURACY 202 BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT 1,144 BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 LS LOAD PER OUTPUT 118 BOTH LEADING & TRAILING EDGE ACCURACY; MAX RISE TIME CAPTURED 138 BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED 154 BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 50MA; MAX RISE TIME CAPTURED 90 BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 60MA; MAX RISE TIME CAPTURED 427 BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 65MA; MAX RISE TIME CAPTURED 84 CAN BE OPERATED ON +5V VCC 154 IMPEDANCE TOL. 10%; INPUT RISE TIME 3NS; TYP. ATTENUATION 10%; MAX RISE TIME CAPTURED 132 IMPEDANCE TOL. 10%; MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX TEMP. COEFF. CAPTURED 450 IN-HOUSE BURN-IN AND THERMAL SHOCK; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. 372 INPUT & OUTPUT ENABLES; TYP. ICC = 60MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 96 INPUT RISE TIME 1NS 214 INPUT RISE TIME 3NS; MAX RISE TIME CAPTURED 194 INPUT TO 1ST TAP DELAY = 3.5+-1NS 80 LENGTH_MAX 2,652 LENGTH_MAX, WIDTH_MAX, SEATED HT_CALCULATED 3,978 LG-MAX 132 LG_MAX 240 LG_MAX, WD_MAX 439 MAX RISE TIME CAPTURED 14,304 MAX WORKING VOLTAGE 25VDC; IMPEDANCE TOL. 5%; TYP. DISTORTION 3%; MAX RISE TIME CAPTURED 158 MAX WORKING VOLTAGE 25VDC; MIN. DIELECTRIC STRENGTH 100VDC; IMPEDANCE TOL. 5% 774 MEETS MIL-D-23859 426 MEETS MIL-D-23859; IMPEDANCE TOL. 10%; INPUT RISE TIME 3NS; MAX ATTENUATION 10% 162 MEETS MIL-D-23859; IMPEDANCE TOL. 10%; INPUT RISE TIME 3NS; MAX RISE TIME & TEMP. COEFF. CAPTURED 104 MEETS MIL-D-23859; IMPEDANCE TOL. 10%; MAX DISTORTION 5%; MAX RISE TIME AND TEMP. COEFF. CAPTURED 1,036 MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. 192 MEETS MIL-D-23859; INPUT RISE TIME 3NS; TYP. ATTENUATION 10%; MAX TEMP. COEFF. CAPTURED 115 MEETS MIL-D-23859; MAX DISTORTION 5%; MAX RISE TIME AND TEMP. COEFF. CAPTURED 246 MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. 508 MEETS MIL-D-23859C; DIELECTRIC STRENGTH 50VDC; MAX DISTORTION 10% 245 MEETS MIL-D-23859C; IMPEDANCE TOL. 10% 219 MIN. FAN OUT OF 10 LSTTL LOADS 85 OUTPUT PULSE WIDTH TOL. = +-1.5NS OR 5%, WHICHEVER IS GREATER; MAX RISE TIME CAPTURED 80 OUTPUT PULSE WIDTH TOL. = +-1NS; TYP. ICC = 30MA; MAX RISE TIME CAPTURED 360 OUTPUT PULSE WIDTH TOL. = +-2NS; TYP. ICC = 30MA; MAX RISE TIME CAPTURED 96 TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 60MA 151 TAP TO TAP DELAY TOL.[NS] VARIES; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 572 TESTED WITH NO LOAD CONDITIONS 86 TYP. ICC = 30MA; MAX FAN OUT OF 8 TTL LOAD PER OUTPUT; MAX TEMP. COEFF. CAPTURED 80 TYP. ICC = 35MA; MAX FAN OUT OF 10 STTL LOAD PER OUTPUT; INTERNAL TERMINATION 192 TYP. ICC = 40MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 510 TYP. ICC = 40MA; MAX FAN OUT OF 10 TTL LOAD PER OUTPUT; MAX RISE TIME CAPTURED 92 TYP. ICC = 60MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 90 TYP. ICC = 60MA; MAX FAN OUT OF 10 STTL LOAD PER OUTPUT; INTERNAL TERMINATION 336 TYP. ICC = 85MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 456 WD-MAX 111 WITH EBAR 219

SQUARE 57

0805 884 1000 320 100K 532 1013 172 10H 749 10K 1,050 1100 432 1135 139 1405 1,285 1410 686 1516 2,530 1518 233 1520 7,956 3D 194 7SIPF 132 9910 140 A04 420 A08 167 A1405 147 ACT 382 AIK 207 AIL 207 AIU 276 AIV 207 AIY 276 AIZ 273 AMY 235 AMZ 237 CMOS 710 CMOS/TTL 1,668 DDU 225 EPA 264 F 7,255 F/FAST 1,447 GL1L 199 HC/UH 748 L52 230 LS 626 LVC/LCX/Z 204 P01 273 P1410 1,376 P2420 232 S 612 SIP 195 SMP1410 405 SMP1610 270 SMWD 376 TTL 5,499 TTL/H/L 164 WS 188

610.49 Hz 1 1.2209 kHz 1 2.4418 kHz 1 4.8832 kHz 1 12.2052 kHz 1 1.25 MHz 3 1.5625 MHz 2 1.6667 MHz 2 1.8182 MHz 2 1.8868 MHz 2 2.2222 MHz 3 2.5 MHz 8 2.6385 MHz 2 2.9762 MHz 2 3.125 MHz 8 3.2363 MHz 2 3.3333 MHz 7 3.6364 MHz 4 4 MHz 2 4.1667 MHz 4 4.6296 MHz 2 5 MHz 8 5.5556 MHz 3 5.9172 MHz 2 6.25 MHz 9 6.6667 MHz 4 6.7797 MHz 3 8.3333 MHz 7 10 MHz 3 10.101 MHz 2 10.3627 MHz 2 10.4167 MHz 3 11.1111 MHz 5 12.5 MHz 4 14.2857 MHz 2 15.625 MHz 3 16.6667 MHz 3 20 MHz 4 23.2558 MHz 2 25 MHz 8 27.7778 MHz 3 30.7692 MHz 2 33.3333 MHz 4 55.5556 MHz 2 83.3333 MHz 2 92.5926 MHz 2 103.52 MHz 3 122.549 MHz 3 125 MHz 67 200 MHz 2

R-CDIP-T8 394 R-CDIP-T9 230 R-PDIP-P4 515 R-PDIP-P8 239 R-PDIP-T14 4,833 R-PDIP-T16 601 R-PDIP-T24 475 R-PDIP-T4 806 R-PDIP-T5 200 R-PDIP-T6 482 R-PDIP-T8 4,909 R-PDIP-T9 444 R-PDSO-C8 397 R-PDSO-G14 3,703 R-PDSO-G16 1,797 R-PDSO-G4 564 R-PDSO-G6 230 R-PDSO-G8 3,190 R-PDSO-J14 476 R-PDSO-J8 607 R-PSIP-T3 328 R-PSIP-T4 611 R-PSIP-T7 202 R-PSIP-T8 502 R-XDIP-P4 470 R-XDIP-P8 335 R-XDIP-T14 5,623 R-XDIP-T16 244 R-XDIP-T24 325 R-XDIP-T4 438 R-XDIP-T8 2,678 R-XDIP-T9 391 R-XDSO-G14 4,712 R-XDSO-G16 309 R-XDSO-G24 485 R-XDSO-G4 920 R-XDSO-G8 2,140 R-XDSO-J14 250 R-XDSO-J4 698 R-XDSO-J8 386 R-XDSO-L4 510 R-XDSO-L8 210 R-XSIP-T14 226 R-XSIP-T3 494 R-XSIP-T4 624 R-XSIP-T8 372 S-PDSO-G8 340 S-XDFP-F14 223 S-XDSO-G14 218 X-XUUC-N 198

e0 12,409 e0/e3 850 e1 84 e3 10,843 e4 111

3 mm 376 4.88 mm 174 4.9 mm 609 5 mm 161 8.695 mm 158 9.375 mm 373 9.65 mm 141 10.16 mm 736 10.3 mm 334 10.335 mm 155 11.43 mm 853 12.45 mm 532 12.7 mm 7,804 12.8 mm 530 12.82 mm 160 12.83 mm 1,602 12.95 mm 365 12.954 mm 255 13.2 mm 1,273 13.55 mm 166 13.66 mm 168 19.05 mm 706 19.304 mm 384 19.305 mm 580 19.43 mm 2,028 19.81 mm 373 19.812 mm 5,018 19.93 mm 399 19.939 mm 251 19.94 mm 1,364 20.06 mm 4,128 20.3 mm 2,139 20.32 mm 6,756 20.57 mm 384 20.6 mm 380 20.82 mm 204 20.828 mm 192 22.09 mm 140 22.098 mm 142 22.352 mm 357 22.6 mm 216 22.86 mm 671 31.75 mm 232 32.258 mm 471 32.512 mm 539 33.02 mm 262 36.83 mm 162 40.64 mm 262 41.91 mm 393 52.832 mm 199

2 pF 7 5 pF 9 10 pF 2,238 11 pF 724 15 pF 1,691 25 pF 81 50 pF 108

ACTIVE DELAY LINE 26,290 PASSIVE DELAY LINE 23,307 PULSE DISCRIMINATOR DELAY LINE 342 PULSE GENERATOR DELAY LINE 3,513 SILICON DELAY LINE 4,766

Allegro MicroSystems LLC 1 Allen Avionics Inc 328 Analog Devices Inc 212 Anaren Microwave 18 Atmel Corporation 1 Bel Fuse 2,147 C&D Technologies Inc 183 Conexant Systems Inc 9 Dallas Semiconductor 1,437 Data Delay Devices Inc 19,083 Data Translation Inc 4 Datatronic Distribution Inc 276 E-San Electronic Co Ltd 56 ELMEC Technology Of America Inc 247 Engineered Components Co 9,584 Esc Electronics Corp 2,450 Floeth Electronic Ltd 1 Freescale Semiconductor 5 Inland Motor 2 iNRCORE LLC 1 Integrated Device Technology Inc 3 Kappa Networks Inc 269 Lexor 112 Linear Technology 44 LSI Computer Systems Inc 4 LSI Corporation 1 MACOM 3 Manutech Inc 1 Maxim Integrated Products 2,310 Micrel Inc 53 Microchip Technology Inc 74 Microsemi Corporation 27 Motorola Mobility LLC 9 Motorola Semiconductor Products 9 Murata Connectivity 7 Murata Manufacturing Co Ltd 78 Murata Power Solutions 205 Natel Engineering Company 23 Nippon Precision Circuits Inc 1 NXP Semiconductors 5 onsemi 51 PCA Electronics Inc 3,485 Philips Semiconductors 1 Polara Engineering Inc 478 Princeton Advanced Components Inc 19 Pulse Electronics Corporation 755 RCD Components Inc 10,541 Renesas Electronics Corporation 2 Rhombus Industries Inc 6,199 Rochester Electronics LLC 302 Seiko NPC Corporation 1 Semtech Corporation 11 Sensata Circuit Breakers 2 Shanghai Belling Co Ltd 4 Signal Technology Corp 57 Signetics 1 Sixnet 1,437 Sony Semiconductor 9 Spectrum Microwave 2 STMicroelectronics 1 Susumu Co Ltd 484 Synergy Semiconductor Corp 8 TDK Corporation 51 TE Connectivity 2 Technitrol Inc 244 Telefunken Microelectronics Gmbh 1 Temic Semiconductors 2 Texas Instruments 31 Thin Film Technology Corp (TFT) 695 TOKO Inc 29 TriQuint Semiconductor 2 TTM Technologies 10 Unicom Electronic Corp 79 Universal Microelectronics Co Ltd 185 Valor 33 Walmsley Microsystems Ltd 1 Yuan Dean Scientific Co Ltd 345

24 mA 3

1 2,069 2 105 3 2,200 4 303 NOT APPLICABLE 36 NOT SPECIFIED 116

1.0 51,856 2.0 2,084 3.0 3,925 4.0 1,134 5.0 13 6.0 18 7.0 148 8.0 36

0 88 1 17,060 2 1,035 3 705 4 758 5 16,452 6 1 7 1,245 8 376 9 1 10 17,220 12 99 14 199 15 837 16 70 20 609 23 3 31 217 63 371 99 6 127 161 255 647 511 4 1023 128 4095 74 8191 2

10 175 11 53 12 226 13 743 14 20,823 15 374 16 3,114 17 187 176 1 18 118 19 69 2 16 20 139 22 5 24 1,482 28 191 3 1,101 32 214 36 8 4 6,757 40 419 44 13 48 22 5 928 6 1,772 64 21 7 533 8 18,003 9 1,416 90 5

70.0 °C 26,244 75.0 °C 379 80.0 °C 85 85.0 °C 8,033 100.0 °C 2 125.0 °C 19,527 140.0 °C 2

-85.0 °C 17 -65.0 °C 65 -55.0 °C 19,433 -54.0 °C 1 -40.0 °C 5,968 -30.0 °C 1,107 -25.0 °C 272 -20.0 °C 7 -10.0 °C 94 0.0 °C 27,308

OPEN-EMITTER 2,312

50 Ω 6,639 55 Ω 199 65 Ω 60 75 Ω 1,043 80 Ω 50 82 Ω 22 93 Ω 159 100 Ω 5,704 150 Ω 6 170 Ω 50 200 Ω 4,618 250 Ω 74 300 Ω 2,572 350 Ω 136 360 Ω 24 400 Ω 40 500 Ω 2,702

COMPLEMENTARY 3,315 INVERTED 755 TRUE 52,505

CERAMIC 209 CERAMIC, GLASS-SEALED 4 CERAMIC, METAL-SEALED COFIRED 1,313 METAL 88 PLASTIC/EPOXY 30,313 UNSPECIFIED 27,199

BGA 343 DFP 316 DIE 269 DIP 26,840 DMA 22 FBGA 1 HTQFP 8 HVQCCN 32 HVSON 48 LBGA 9 LFQFP 2 LQFP 28 LSOP 6 LSSOP 7 QCCJ 180 QCCN 26 QFF 2 QFP 45 QIP 1,359 QMA 10 SIP 4,393 SOC 801 SOJ 3,158 SOL 1,158 SON 80 SOP 19,218 SSOP 6 TBGA 26 TQFP 47 TSOP 4 TSSOP 467 VBGA 66 VFBGA 22 VQCCN 45 VSON 5 VSSOP 56

DIE OR CHIP 247 DIP14(UNSPEC) 81 DIP14,.3 9,559 DIP16,.3 1,307 DIP24,.3 96 DIP24,.4 187 DIP24,.6 124 DIP32,.3 392 DIP4/14,.3 324 DIP4/8,.3 374 DIP40,.6 176 DIP48,.3 132 DIP6/16,.3 84 DIP8(UNSPEC) 404 DIP8,.3 3,316 DIP8/14,.3 620 DIP8/16,.3 176 DIP9/16,.3 86 GWDIP14,.3 195 GWDIP14,.4 2,903 GWDIP16,.9 304 GWDIP24,.9 228 GWDIP4/14,.5 91 GWDIP4/8,.5 389 GWDIP8,.3 127 GWDIP8,.4 1,049 GWDIP8,.45 607 LDCC28,.5SQ 86 SIP3,.04 101 SIP4/5,.1 163 SIP8(UNSPEC) 380 SIP8,.06 319 SMDIP14,.3 242 SMDIP4/14,.44 91 SMDIP4/8,.33 85 SMDIP4/8,.38 352 SMDIP4/8,.4 85 SMDIP4/8,.44 352 SMDIP8,.3 501 SOC14,.5 171 SOC8/14,.5 256 SOP14,.25 181 SOP14,.3 202 SOP14,.4 2,828 SOP14,.65 92 SOP16,.25 104 SOP16,.4 448 SOP8,.25 690 SOP8/14,.4 480 TSSOP8,.19 291

RECTANGULAR 57,436 SQUARE 1,422 UNSPECIFIED 251

CHIP CARRIER 212 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE 26 CHIP CARRIER, VERY THIN PROFILE 45 FLATPACK 361 FLATPACK, HEAT SINK/SLUG, THIN PROFILE 8 FLATPACK, LOW PROFILE 28 FLATPACK, LOW PROFILE, FINE PITCH 2 FLATPACK, THIN PROFILE 47 GRID ARRAY 343 GRID ARRAY, FINE PITCH 1 GRID ARRAY, LOW PROFILE 9 GRID ARRAY, THIN PROFILE 26 GRID ARRAY, VERY THIN PROFILE 66 GRID ARRAY, VERY THIN PROFILE, FINE PITCH 22 IN-LINE 32,353 MICROELECTRONIC ASSEMBLY 461 SMALL OUTLINE 24,256 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 36 SMALL OUTLINE, LOW PROFILE 6 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 7 SMALL OUTLINE, SHRINK PITCH 6 SMALL OUTLINE, THIN PROFILE 4 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 467 SMALL OUTLINE, VERY THIN PROFILE 5 SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH 44 UNCASED CHIP 269

BULK 2,696 RAIL 1 TR 343 TR, 7 INCH 8 TRAY 7 TUBE 117

4.72 ns 55 5 ns 83 6 ns 97 7 ns 69 8 ns 99 9 ns 78 10 ns 237 11 ns 59 12 ns 144 13 ns 62 14 ns 87 15 ns 193 16 ns 81 17 ns 68 18 ns 85 19 ns 53 20 ns 306 21 ns 87 22 ns 86 23 ns 61 24 ns 75 25 ns 410 30 ns 342 35 ns 249 40 ns 331 42 ns 49 45 ns 230 50 ns 467 55 ns 60 60 ns 316 65 ns 57 70 ns 119 75 ns 388 80 ns 140 85 ns 50 90 ns 84 100 ns 480 125 ns 292 150 ns 386 175 ns 227 200 ns 421 225 ns 73 250 ns 388 300 ns 231 350 ns 136 400 ns 189 450 ns 116 500 ns 284 750 ns 54 1 µs 73

-5.2 V 585 -5 V 424 -4.5 V 188 1.5 V 8 2.5 V 67 3 V 129 3.3 V 1,759 5 V 30,580 5.2 V 3 30 V 57 50 V 98

NO 32,640 YES 26,503

4 ns 238 5 ns 856 6 ns 528 7 ns 471 7.5 ns 182 8 ns 562 9 ns 473 10 ns 1,516 11 ns 256 12 ns 466 13 ns 250 14 ns 296 15 ns 1,074 16 ns 345 17 ns 182 18 ns 227 20 ns 2,118 24 ns 188 25 ns 1,856 30 ns 2,044 35 ns 919 40 ns 2,190 45 ns 1,035 50 ns 2,810 55 ns 185 60 ns 2,298 70 ns 624 75 ns 2,404 80 ns 986 90 ns 552 100 ns 2,792 110 ns 226 120 ns 770 125 ns 1,253 150 ns 2,214 175 ns 591 180 ns 811 200 ns 2,279 220 ns 624 225 ns 240 250 ns 1,981 300 ns 1,371 350 ns 395 375 ns 521 400 ns 608 450 ns 344 500 ns 1,458 600 ns 444 750 ns 419 1 µs 511