Part Details for ZXTP08400BFFTA by Zetex / Diodes Inc
Results Overview of ZXTP08400BFFTA by Zetex / Diodes Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Renewable Energy
Automotive
ZXTP08400BFFTA Information
ZXTP08400BFFTA by Zetex / Diodes Inc is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for ZXTP08400BFFTA
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
88773852
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Verical | Trans GP BJT PNP 400V 0.2A 2000mW 3-Pin SOT-23F T/R RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Date Code: 2319 | Americas - 51000 |
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$0.1625 | Buy Now |
Part Details for ZXTP08400BFFTA
ZXTP08400BFFTA CAD Models
ZXTP08400BFFTA Part Data Attributes
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ZXTP08400BFFTA
Zetex / Diodes Inc
Buy Now
Datasheet
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ZXTP08400BFFTA
Zetex / Diodes Inc
Power Bipolar Transistor, 0.2A I(C), 400V V(BR)CEO, 1-Element, PNP, Silicon, Plastic/Epoxy, 3 Pin, SOT-23F, 3 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ZETEX PLC | |
| Package Description | SOT-23F, 3 PIN | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Collector Current-Max (IC) | 0.2 A | |
| Collector-Emitter Voltage-Max | 400 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 100 | |
| JESD-30 Code | R-PDSO-G3 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | PNP | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| Transition Frequency-Nom (fT) | 70 MHz |
ZXTP08400BFFTA Frequently Asked Questions (FAQ)
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A good PCB layout for the ZXTP08400BFFTA should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern under the device. A minimum of 2oz copper thickness is recommended.
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To ensure reliable operation at high temperatures, ensure the device is properly heatsinked, and the PCB is designed to minimize thermal resistance. Also, consider derating the device's power handling at high temperatures.
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The ZXTP08400BFFTA has built-in ESD protection, but handling precautions are still necessary. Handle the device by the body, avoid touching the pins, and use an anti-static wrist strap or mat during assembly.
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The ZXTP08400BFFTA is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper design, testing, and validation. Consult with the manufacturer for specific requirements and guidance.
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Follow the manufacturer's recommended soldering profile, and use a soldering iron with a temperature range of 250°C to 260°C. For rework, use a low-temperature soldering iron and a solder wick or desoldering braid to minimize thermal stress.