Part Details for ZSC31050FIC by Integrated Device Technology Inc
Results Overview of ZSC31050FIC by Integrated Device Technology Inc
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Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
ZSC31050FIC Information
ZSC31050FIC by Integrated Device Technology Inc is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Part Details for ZSC31050FIC
ZSC31050FIC CAD Models
ZSC31050FIC Part Data Attributes
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ZSC31050FIC
Integrated Device Technology Inc
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Datasheet
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ZSC31050FIC
Integrated Device Technology Inc
WAFER-0, Wafer
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | WAFER | |
| Package Description | DIE | |
| Pin Count | 0 | |
| Manufacturer Package Code | DICEF | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 |
ZSC31050FIC Frequently Asked Questions (FAQ)
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The recommended pin out configuration for optimal performance can be found in the 'Application Notes' section of the datasheet. However, as a general rule, it's recommended to keep the analog and digital grounds separate, and to use a low-impedance clock source to minimize jitter.
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The ZSC31050FIC can be configured for multiple voltage rails by using the 'VCC_SEL' pin to select between different voltage sources. Additionally, the 'VREF' pin can be connected to a voltage reference or a resistive divider to generate a stable reference voltage.
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The recommended layout and routing for the device involves keeping the analog and digital signal paths separate, using ground planes to reduce noise, and minimizing the length of the signal paths to reduce latency. A 4-layer PCB with a dedicated ground plane is recommended.
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The ZSC31050FIC has built-in fault detection mechanisms such as over-temperature detection and voltage monitor. To implement fault correction mechanisms, engineers can use the 'FAULT' pin to detect faults and trigger corrective actions such as resetting the device or alerting the system controller.
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The recommended calibration procedure for the ZSC31050FIC involves trimming the internal voltage reference and gain calibration using the 'CAL' pin. A calibration sequence can be implemented using a microcontroller or a dedicated calibration device.