Part Details for Z8F1680QN020SG by Zilog Inc
Results Overview of Z8F1680QN020SG by Zilog Inc
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Z8F1680QN020SG Information
Z8F1680QN020SG by Zilog Inc is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for Z8F1680QN020SG
Z8F1680QN020SG CAD Models
Z8F1680QN020SG Part Data Attributes
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Z8F1680QN020SG
Zilog Inc
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Datasheet
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Z8F1680QN020SG
Zilog Inc
IC 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP44, GREEN, QFN-44, Microcontroller
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ZILOG INC | |
| Part Package Code | QFN | |
| Package Description | LQFP, LCC44,.28SQ,20 | |
| Pin Count | 44 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 8 | |
| CPU Family | Z8 | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G44 | |
| JESD-609 Code | e3 | |
| Length | 10 mm | |
| Number of I/O Lines | 37 | |
| Number of Terminals | 44 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | LCC44,.28SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 1024 | |
| ROM (words) | 16384 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 20 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 2.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Z8F1680QN020SG Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper areas. A thermal via array can also be used to improve heat dissipation.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves, ensure good thermal management, and consider using a heat sink or thermal interface material. Additionally, the device should be operated within the specified maximum junction temperature (Tj) of 150°C.
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The Z8F1680QN020SG has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing. The device can withstand ESD voltages up to ±2 kV according to the Human Body Model (HBM) and ±200 V according to the Machine Model (MM).
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Yes, the Z8F1680QN020SG is suitable for high-reliability and automotive applications. It is manufactured using a high-reliability process, and IXYS Corporation provides a range of quality and reliability certifications, including AEC-Q101 and ISO/TS 16949. However, it is essential to consult with IXYS Corporation for specific requirements and certifications.
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The recommended soldering conditions for the Z8F1680QN020SG involve using a peak reflow temperature of 260°C, with a maximum time above 220°C of 60 seconds. The device is compatible with lead-free soldering processes, and it is recommended to follow the IPC-J-STD-020 standard for soldering and assembly.