Datasheets
Z86E3016SSG by:

Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28

Part Details for Z86E3016SSG by IXYS Corporation

Results Overview of Z86E3016SSG by IXYS Corporation

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Applications Automotive

Z86E3016SSG Information

Z86E3016SSG by IXYS Corporation is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for Z86E3016SSG

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Z86E3016SSG Part Data Attributes

Z86E3016SSG IXYS Corporation
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Z86E3016SSG IXYS Corporation Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer IXYS CORP
Part Package Code SOIC
Package Description SOIC-28
Pin Count 28
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Has ADC NO
Address Bus Width 8
Bit Size 8
CPU Family Z8
Clock Frequency-Max 16 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code R-PDSO-G28
JESD-609 Code e3
Length 17.9 mm
Moisture Sensitivity Level 1
Number of I/O Lines 24
Number of Terminals 28
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C
Operating Temperature-Min
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Qualification Status Not Qualified
RAM (bytes) 237
ROM (words) 4096
ROM Programmability OTPROM
Seated Height-Max 2.64 mm
Speed 16 MHz
Supply Current-Max 25 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 3.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Width 7.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

Alternate Parts for Z86E3016SSG

This table gives cross-reference parts and alternative options found for Z86E3016SSG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of Z86E3016SSG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
Z86E3016SSG Littelfuse Inc Check for Price Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 Z86E3016SSG vs Z86E3016SSG
Z86E3016SSG Zilog Inc Check for Price IC 8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PDSO28, SOIC-28, Microcontroller Z86E3016SSG vs Z86E3016SSG
Z86E3016SSC IXYS Corporation Check for Price Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 Z86E3016SSG vs Z86E3016SSC
Z86E3016SEC IXYS Corporation Check for Price Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 Z86E3016SSG vs Z86E3016SEC
Z86E3016SSC Littelfuse Inc Check for Price Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 Z86E3016SSG vs Z86E3016SSC
Z86E3016SSC Zilog Inc Check for Price IC 8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PDSO28, SOIC-28, Microcontroller Z86E3016SSG vs Z86E3016SSC

Z86E3016SSG Related Parts

Z86E3016SSG Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.

  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.

  • The Z86E3016SSG has an internal ESD protection diode, but it is still recommended to follow standard ESD handling procedures when handling the device. Additionally, it is recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines to protect against external ESD events.

  • Yes, the Z86E3016SSG can be used in switching power supply applications, but it is essential to ensure that the device is operated within its recommended switching frequency range and that the output voltage is properly filtered to minimize ringing and overshoot.

  • To troubleshoot issues with the device, it is recommended to follow a systematic approach, including checking the input voltage, output voltage, and current, as well as verifying that the device is operated within its recommended operating conditions. Additionally, it may be helpful to use a oscilloscope to monitor the device's behavior and identify any anomalies.

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