Part Details for Z86E3016SSG by IXYS Corporation
Results Overview of Z86E3016SSG by IXYS Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Z86E3016SSG Information
Z86E3016SSG by IXYS Corporation is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for Z86E3016SSG
Z86E3016SSG CAD Models
Z86E3016SSG Part Data Attributes
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Z86E3016SSG
IXYS Corporation
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Datasheet
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Z86E3016SSG
IXYS Corporation
Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | IXYS CORP | |
Part Package Code | SOIC | |
Package Description | SOIC-28 | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Address Bus Width | 8 | |
Bit Size | 8 | |
CPU Family | Z8 | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G28 | |
JESD-609 Code | e3 | |
Length | 17.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of I/O Lines | 24 | |
Number of Terminals | 28 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP28,.4 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Qualification Status | Not Qualified | |
RAM (bytes) | 237 | |
ROM (words) | 4096 | |
ROM Programmability | OTPROM | |
Seated Height-Max | 2.64 mm | |
Speed | 16 MHz | |
Supply Current-Max | 25 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 7.5 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Alternate Parts for Z86E3016SSG
This table gives cross-reference parts and alternative options found for Z86E3016SSG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of Z86E3016SSG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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Z86E3016SSG | Littelfuse Inc | Check for Price | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Z86E3016SSG vs Z86E3016SSG |
Z86E3016SSG | Zilog Inc | Check for Price | IC 8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PDSO28, SOIC-28, Microcontroller | Z86E3016SSG vs Z86E3016SSG |
Z86E3016SSC | IXYS Corporation | Check for Price | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Z86E3016SSG vs Z86E3016SSC |
Z86E3016SEC | IXYS Corporation | Check for Price | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Z86E3016SSG vs Z86E3016SEC |
Z86E3016SSC | Littelfuse Inc | Check for Price | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 16MHz, CMOS, PDSO28, SOIC-28 | Z86E3016SSG vs Z86E3016SSC |
Z86E3016SSC | Zilog Inc | Check for Price | IC 8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PDSO28, SOIC-28, Microcontroller | Z86E3016SSG vs Z86E3016SSC |
Z86E3016SSG Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.
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The Z86E3016SSG has an internal ESD protection diode, but it is still recommended to follow standard ESD handling procedures when handling the device. Additionally, it is recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines to protect against external ESD events.
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Yes, the Z86E3016SSG can be used in switching power supply applications, but it is essential to ensure that the device is operated within its recommended switching frequency range and that the output voltage is properly filtered to minimize ringing and overshoot.
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To troubleshoot issues with the device, it is recommended to follow a systematic approach, including checking the input voltage, output voltage, and current, as well as verifying that the device is operated within its recommended operating conditions. Additionally, it may be helpful to use a oscilloscope to monitor the device's behavior and identify any anomalies.