Part Details for XQR5VFX130-1CN1752V by AMD
Results Overview of XQR5VFX130-1CN1752V by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XQR5VFX130-1CN1752V Information
XQR5VFX130-1CN1752V by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XQR5VFX130-1CN1752V
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
XQR5VFX130-1CN1752V
|
Avnet Silica | XLXXQR5VFX1301CN1752V RADIATIONHARDENE (Alt: XQR5VFX130-1CN1752V) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 27 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for XQR5VFX130-1CN1752V
XQR5VFX130-1CN1752V CAD Models
XQR5VFX130-1CN1752V Part Data Attributes
|
|
XQR5VFX130-1CN1752V
AMD
Buy Now
Datasheet
|
Compare Parts:
XQR5VFX130-1CN1752V
AMD
Field Programmable Gate Array, 10240 CLBs, 131072-Cell, CMOS, CBGA1752, CGA-1752
|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | CGA-1752 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | AMD | |
| Combinatorial Delay of a CLB-Max | 0.11 ns | |
| JESD-30 Code | S-CBGA-X1752 | |
| Length | 45 mm | |
| Number of CLBs | 10240 | |
| Number of Logic Cells | 131072 | |
| Number of Terminals | 1752 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 10240 CLBS | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 8.8 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Total Dose | 1M Rad(Si) V | |
| Width | 45 mm |
Alternate Parts for XQR5VFX130-1CN1752V
This table gives cross-reference parts and alternative options found for XQR5VFX130-1CN1752V. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XQR5VFX130-1CN1752V, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XQR5VFX130-1CN1752V | AMD Xilinx | Check for Price | Field Programmable Gate Array, 10240 CLBs, CMOS, CBGA1752, CGA-1752 | XQR5VFX130-1CN1752V vs XQR5VFX130-1CN1752V |
| XQR5VFX130-1CN1752B | AMD Xilinx | Check for Price | Field Programmable Gate Array, 10240 CLBs, CMOS, CBGA1752, CGA-1752 | XQR5VFX130-1CN1752V vs XQR5VFX130-1CN1752B |
| XQR5VFX130-1CF1752B | AMD Xilinx | Check for Price | Field Programmable Gate Array, 10240 CLBs, CMOS, CBGA1752, CGA-1752 | XQR5VFX130-1CN1752V vs XQR5VFX130-1CF1752B |
XQR5VFX130-1CN1752V Frequently Asked Questions (FAQ)
-
AMD provides a PCB design guide and layout recommendations in their documentation, but it's also recommended to consult with experienced PCB designers and perform signal integrity simulations to ensure optimal performance.
-
AMD provides power estimation tools and thermal design guides. Additionally, engineers can use techniques like clock gating, dynamic voltage and frequency scaling, and thermal-aware design to minimize power consumption and heat generation.
-
AMD recommends using secure boot mechanisms, such as authenticated boot and encrypted bitstreams, to prevent tampering and ensure the integrity of the FPGA's configuration. Additionally, engineers should implement secure key management and storage practices.
-
AMD provides a range of debugging tools, including ChipScope and Vivado Logic Analyzer. Engineers can also use techniques like signal tapping, logic analysis, and simulation-based debugging to identify and resolve issues.
-
Engineers should carefully review the transceiver specifications and limitations, including bandwidth, latency, and jitter tolerance. They should also consider the impact of PCB layout, signal integrity, and clocking on transceiver performance.