Part Details for XPC8240LVV200E by NXP Semiconductors
Results Overview of XPC8240LVV200E by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
XPC8240LVV200E Information
XPC8240LVV200E by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XPC8240LVV200E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
25967126
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Verical | MPU PowerQUICC II RISC 32bit 0.29um 200MHz 3.3V 352-Pin TBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1042 | Americas - 5 |
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$34.7900 | Buy Now |
Part Details for XPC8240LVV200E
XPC8240LVV200E CAD Models
XPC8240LVV200E Part Data Attributes
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XPC8240LVV200E
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
XPC8240LVV200E
NXP Semiconductors
RISC Microprocessor
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | TBGA-352 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 66 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B352 | |
| Length | 35 mm | |
| Low Power Mode | YES | |
| Number of DMA Channels | 2 | |
| Number of Terminals | 352 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Seated Height-Max | 1.65 mm | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
XPC8240LVV200E Frequently Asked Questions (FAQ)
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The recommended operating temperature range for the XPC8240LVV200E is -40°C to 105°C, as specified in the datasheet. However, it's essential to note that the device can operate at temperatures beyond this range, but with reduced performance and reliability.
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The clock settings for the XPC8240LVV200E can be configured using the Clock Generator Module (CGM) and the Phase-Locked Loop (PLL) module. The CGM generates the clock signals, while the PLL module allows for frequency multiplication and division. Refer to the datasheet and the NXP Semiconductors' application notes for detailed configuration guidelines.
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The maximum current draw of the XPC8240LVV200E depends on the operating frequency, voltage, and temperature. According to the datasheet, the maximum current draw is approximately 450 mA at 200 MHz, 1.8V, and 25°C. However, this value may vary depending on the specific application and operating conditions.
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The XPC8240LVV200E has built-in power management features, including power-down modes and dynamic voltage and frequency scaling. To implement power management, use the Power Management Controller (PMC) module to configure the power modes, and the Clock Generator Module (CGM) to adjust the clock frequency and voltage. Refer to the datasheet and NXP Semiconductors' application notes for detailed guidelines.
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When designing a PCB with the XPC8240LVV200E, consider the following: keep the power supply lines short and wide, use decoupling capacitors, and ensure good thermal dissipation. Also, follow the recommended land pattern and pin assignment to minimize signal integrity issues and ensure reliable operation.