Part Details for XCZU7EG-1FBVB900E by AMD Xilinx
Results Overview of XCZU7EG-1FBVB900E by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Telecommunications
Communication and Networking
XCZU7EG-1FBVB900E Information
XCZU7EG-1FBVB900E by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU7EG-1FBVB900E
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 556 |
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RFQ |
Part Details for XCZU7EG-1FBVB900E
XCZU7EG-1FBVB900E CAD Models
XCZU7EG-1FBVB900E Part Data Attributes
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XCZU7EG-1FBVB900E
AMD Xilinx
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Datasheet
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XCZU7EG-1FBVB900E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU7EG-1FBVB900E Frequently Asked Questions (FAQ)
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The maximum power consumption of XCZU7EG-1FBVB900E is approximately 12W, but it can vary depending on the specific use case and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating temperature of XCZU7EG-1FBVB900E is 100°C (junction temperature), but it's recommended to operate within 0°C to 85°C for optimal performance and reliability.
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To ensure signal integrity, follow Xilinx's guidelines for PCB design, use controlled impedance traces, and implement signal termination and filtering as needed. Additionally, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity.
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The maximum frequency of XCZU7EG-1FBVB900E depends on the specific device configuration and operating conditions, but it can reach up to 500 MHz for the processing system (PS) clock and up to 1 GHz for the programmable logic (PL) clock.