Part Details for XCZU6EG-2FFVC900I by AMD Xilinx
Results Overview of XCZU6EG-2FFVC900I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
XCZU6EG-2FFVC900I Information
XCZU6EG-2FFVC900I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU6EG-2FFVC900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 875 |
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RFQ |
Part Details for XCZU6EG-2FFVC900I
XCZU6EG-2FFVC900I CAD Models
XCZU6EG-2FFVC900I Part Data Attributes
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XCZU6EG-2FFVC900I
AMD Xilinx
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Datasheet
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XCZU6EG-2FFVC900I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU6EG-2FFVC900I Frequently Asked Questions (FAQ)
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The maximum power consumption of XCZU6EG-2FFVC900I is approximately 12W, but it can vary depending on the specific use case and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating temperature of XCZU6EG-2FFVC900I is 100°C (junction temperature) and 85°C (ambient temperature).
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To ensure signal integrity, follow the Xilinx signal integrity guidelines, use the Xilinx IBIS-AMI models, and perform signal integrity analysis using tools such as HyperLynx or Mentor Graphics Hyperlynx.
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The maximum frequency of XCZU6EG-2FFVC900I is 550 MHz, but it can vary depending on the specific use case and operating conditions.