Part Details for XCZU6EG-2FFVB1156I by AMD Xilinx
Results Overview of XCZU6EG-2FFVB1156I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
XCZU6EG-2FFVB1156I Information
XCZU6EG-2FFVB1156I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU6EG-2FFVB1156I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 1015 |
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RFQ |
Part Details for XCZU6EG-2FFVB1156I
XCZU6EG-2FFVB1156I CAD Models
XCZU6EG-2FFVB1156I Part Data Attributes
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XCZU6EG-2FFVB1156I
AMD Xilinx
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Datasheet
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XCZU6EG-2FFVB1156I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA1156, FLIPCHIP-1156
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1156 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1156 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU6EG-2FFVB1156I Frequently Asked Questions (FAQ)
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The maximum power consumption of XCZU6EG-2FFVB1156I is approximately 12W, but it can vary depending on the specific use case and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating temperature of XCZU6EG-2FFVB1156I is 100°C (junction temperature), but it's recommended to operate within 0°C to 85°C for optimal performance and reliability.
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To ensure signal integrity, follow the Xilinx PCB design guidelines, use controlled impedance routing, and add decoupling capacitors to minimize noise and signal degradation.
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The recommended PCB material for XCZU6EG-2FFVB1156I is a high-quality, low-loss material such as FR4 or Rogers 4350B, with a thickness of 0.8mm to 1.6mm.