Part Details for XCZU6CG-1FFVC900I by AMD Xilinx
Results Overview of XCZU6CG-1FFVC900I by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Telecommunications
XCZU6CG-1FFVC900I Information
XCZU6CG-1FFVC900I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU6CG-1FFVC900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 227 |
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RFQ | ||
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MacroQuest Electronics | FPGA Zynq UltraScale+ Family 469446 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray | 110 |
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$2,644.8400 / $2,813.5600 | Buy Now |
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Vyrian | Peripheral ICs | 1450 |
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RFQ |
Part Details for XCZU6CG-1FFVC900I
XCZU6CG-1FFVC900I CAD Models
XCZU6CG-1FFVC900I Part Data Attributes
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XCZU6CG-1FFVC900I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCZU6CG-1FFVC900I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU6CG-1FFVC900I Frequently Asked Questions (FAQ)
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The maximum power consumption of XCZU6CG-1FFVC900I is approximately 12W, but it can vary depending on the specific application and usage.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating temperature of XCZU6CG-1FFVC900I is 100°C (industrial grade) or 125°C (extended grade).
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To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity, and follow best practices for PCB design, such as using differential pairs, adding termination resistors, and minimizing signal routing.
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The maximum clock frequency of XCZU6CG-1FFVC900I is 500 MHz, but it can vary depending on the specific application and usage.