Part Details for XCZU4EV-L1FBVB900I by AMD Xilinx
Results Overview of XCZU4EV-L1FBVB900I by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCZU4EV-L1FBVB900I Information
XCZU4EV-L1FBVB900I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU4EV-L1FBVB900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | IC SOC CORTEX-A53 900FCBGA | 24 |
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$2,045.8400 / $2,221.8700 | Buy Now |
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Vyrian | Peripheral ICs | 1600 |
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RFQ |
Part Details for XCZU4EV-L1FBVB900I
XCZU4EV-L1FBVB900I CAD Models
XCZU4EV-L1FBVB900I Part Data Attributes
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XCZU4EV-L1FBVB900I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCZU4EV-L1FBVB900I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.742 V | |
| Supply Voltage-Min | 0.698 V | |
| Supply Voltage-Nom | 0.72 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU4EV-L1FBVB900I Frequently Asked Questions (FAQ)
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The maximum power consumption of XCZU4EV-L1FBVB900I is around 12W, but it can vary depending on the specific use case and operating conditions.
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To optimize power consumption, you can use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, you can use the Xilinx Power Estimator (XPE) tool to estimate and optimize power consumption.
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The maximum operating temperature of XCZU4EV-L1FBVB900I is 100°C (junction temperature) and 85°C (ambient temperature).
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To ensure signal integrity, you should follow the guidelines provided in the Xilinx Signal Integrity User Guide, including using proper termination, routing, and layout techniques. Additionally, you can use the Xilinx IBERT (Integrated Bit Error Ratio Tester) tool to test and validate the high-speed interfaces.
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The recommended PCB material is FR4 or a similar high-speed material, with a stackup that includes a minimum of 4 layers (2 signal layers, 1 power layer, and 1 ground layer). The specific stackup requirements may vary depending on the design requirements and operating frequency.