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Part Details for XCZU3EG-1SFVC784E by AMD
Results Overview of XCZU3EG-1SFVC784E by AMD
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCZU3EG-1SFVC784E Information
XCZU3EG-1SFVC784E by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU3EG-1SFVC784E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
32AC9747
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Newark | Mpsoc, Arm Cortex-A53, 1.5Ghz, Fcbga-784, Product Range:Zynq Family Ultrascale+ Eg Series Microprocessors, Cpu Speed:1.5Ghz, Core Architecture:Arm Cortex-A53, Mpu Case Style:Fcbga, No. Of Pins:784Pins, Msl:-, Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd XCZU3EG-1SFVC784E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$565.4400 | Buy Now |
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DISTI #
XCZU3EG-1SFVC784E-ND
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DigiKey | IC SOC CORTEX-A53 784FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
2 In Stock |
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$565.5000 | Buy Now |
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DISTI #
XCZU3EG-1SFVC784E
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Avnet Americas | - Trays (Alt: XCZU3EG-1SFVC784E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$554.1312 | Buy Now |
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DISTI #
217-CZU3EG-1SFVC784E
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Mouser Electronics | SoC FPGA XCZU3EG-1SFVC784E RoHS: Compliant | 1 |
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$565.4400 | Buy Now |
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DISTI #
XCZU3EG-1SFVC784E
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Avnet Silica | (Alt: XCZU3EG-1SFVC784E) RoHS: Compliant Min Qty: 1 Package Multiple: 60 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XCZU3EG-1SFVC784E
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EBV Elektronik | (Alt: XCZU3EG-1SFVC784E) RoHS: Compliant Min Qty: 2 Package Multiple: 60 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Win Source Electronics | IC SOC CORTEX-A53 784FCBGA / Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC series Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 500MHz, 600MHz, 1.2GHz 784-FCBGA (23x23) | 1150 |
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$87.5876 / $104.4313 | Buy Now |
Part Details for XCZU3EG-1SFVC784E
XCZU3EG-1SFVC784E CAD Models
XCZU3EG-1SFVC784E Part Data Attributes
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XCZU3EG-1SFVC784E
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU3EG-1SFVC784E
AMD
Microprocessor Circuit, CMOS, PBGA784, FCBGA-784
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-784 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| JESD-30 Code | R-PBGA-B784 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 784 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU3EG-1SFVC784E Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCZU3EG-1SFVC784E is approximately 12W, but it can vary depending on the specific design, clock frequency, and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes. Additionally, consider using the AMD-provided power optimization IP cores and following the Xilinx Power Management Guide.
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The XCZU3EG-1SFVC784E has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
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Yes, the XCZU3EG-1SFVC784E is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its robust design, error correction mechanisms, and compliance with various industry standards (e.g., DO-254, IEC 61508).
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To ensure signal integrity, follow the Xilinx Signal Integrity Guidelines, use the Vivado Design Suite's signal integrity analysis tools, and consider using the built-in signal conditioning and termination features of the FPGA.