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Programmable SoC, CMOS, PBGA484,
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCZU2EG-L1SBVA484I by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-2053-ND
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DigiKey | IC SOC CORTEX-A53 484FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
6 In Stock |
|
$469.3000 | Buy Now |
DISTI #
XCZU2EG-L1SBVA484I
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Avnet Americas | - Trays (Alt: XCZU2EG-L1SBVA484I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
$429.5900 | Buy Now |
DISTI #
217-ZU2EG-L1SBVA484I
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Mouser Electronics | SoC FPGA XCZU2EG-L1SBVA484I RoHS: Compliant | 3 |
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$469.2500 | Buy Now |
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XCZU2EG-L1SBVA484I
AMD
Buy Now
Datasheet
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Compare Parts:
XCZU2EG-L1SBVA484I
AMD
Programmable SoC, CMOS, PBGA484,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
JESD-30 Code | R-PBGA-B484 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Supply Voltage-Max | 0.742 V | |
Supply Voltage-Min | 0.698 V | |
Supply Voltage-Nom | 0.72 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC |
AMD provides a PCB design guide and layout recommendations in the UG583 document, which includes guidelines for signal integrity, power distribution, and thermal management.
To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
The IBERT in the XCZU2EG-L1SBVA484I has limitations on the number of lanes, data transfer rates, and supported PCIe specifications. Refer to the PG201 document for detailed information on IBERT capabilities and limitations.
AMD provides a Security Manual (UG470) that outlines the security features and implementation guidelines for the XCZU2EG-L1SBVA484I. Additionally, use the Xilinx Vivado Design Suite to implement and verify the security features.
The XCZU2EG-L1SBVA484I has a maximum junction temperature of 100°C. Ensure proper thermal management by using a heat sink, thermal interface material, and following the thermal design guidelines in the UG583 document.