Part Details for XCZU19EG-2FFVC1760E by AMD Xilinx
Results Overview of XCZU19EG-2FFVC1760E by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCZU19EG-2FFVC1760E Information
XCZU19EG-2FFVC1760E by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU19EG-2FFVC1760E
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | IC SOC CORTEX-A53 1760FCBGA | 300 |
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$7,545.3700 / $8,876.9100 | Buy Now |
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Vyrian | Peripheral ICs | 1 |
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RFQ |
Part Details for XCZU19EG-2FFVC1760E
XCZU19EG-2FFVC1760E CAD Models
XCZU19EG-2FFVC1760E Part Data Attributes
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XCZU19EG-2FFVC1760E
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XCZU19EG-2FFVC1760E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1760 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Date Of Intro | 2017-02-15 | |
| JESD-30 Code | S-PBGA-B1760 | |
| JESD-609 Code | e1 | |
| Length | 42.5 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1760 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.71 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 42.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU19EG-2FFVC1760E Frequently Asked Questions (FAQ)
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The maximum power consumption of XCZU19EG-2FFVC1760E is approximately 25W, but it can vary depending on the specific use case and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating temperature of XCZU19EG-2FFVC1760E is 100°C (junction temperature) and 85°C (ambient temperature).
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To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity, and follow best practices for PCB design, such as using differential pairs, adding termination resistors, and minimizing signal routing.
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The maximum frequency of XCZU19EG-2FFVC1760E is 500 MHz, but it can vary depending on the specific use case and operating conditions.