Part Details for XCZU17EG-L1FFVB1517I by AMD Xilinx
Results Overview of XCZU17EG-L1FFVB1517I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
XCZU17EG-L1FFVB1517I Information
XCZU17EG-L1FFVB1517I by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCZU17EG-L1FFVB1517I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 1075 |
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RFQ |
Part Details for XCZU17EG-L1FFVB1517I
XCZU17EG-L1FFVB1517I CAD Models
XCZU17EG-L1FFVB1517I Part Data Attributes
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XCZU17EG-L1FFVB1517I
AMD Xilinx
Buy Now
Datasheet
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XCZU17EG-L1FFVB1517I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA1517, FLIPCHIP-1517
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-1517 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.742 V | |
| Supply Voltage-Min | 0.698 V | |
| Supply Voltage-Nom | 0.72 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
XCZU17EG-L1FFVB1517I Frequently Asked Questions (FAQ)
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The maximum power consumption of XCZU17EG-L1FFVB1517I is around 12W, but it can vary depending on the specific use case and operating conditions.
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To optimize power consumption, you can use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization.
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The maximum operating temperature of XCZU17EG-L1FFVB1517I is 100°C, but it's recommended to operate it at a temperature below 85°C for optimal performance and reliability.
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To ensure signal integrity, you should follow the guidelines provided in the Xilinx PCB Design Guide and the IBIS model for the specific interface. You should also use signal integrity analysis tools like HyperLynx or Mentor Graphics to simulate and optimize the design.
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No, XCZU17EG-L1FFVB1517I is not a radiation-hardened device. If you need a radiation-hardened device, you should consider using a Xilinx device that is specifically designed for space or high-reliability applications, such as the XQR or QPRO families.