Part Details for XCVU9P-L2FLGA2577E by AMD Xilinx
Results Overview of XCVU9P-L2FLGA2577E by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Telecommunications
XCVU9P-L2FLGA2577E Information
XCVU9P-L2FLGA2577E by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCVU9P-L2FLGA2577E
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | IC FPGA 448 I/O 2577FCBGA | 86 |
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$58,662.3900 / $67,038.6900 | Buy Now |
Part Details for XCVU9P-L2FLGA2577E
XCVU9P-L2FLGA2577E CAD Models
XCVU9P-L2FLGA2577E Part Data Attributes
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XCVU9P-L2FLGA2577E
AMD Xilinx
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Datasheet
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XCVU9P-L2FLGA2577E
AMD Xilinx
Field Programmable Gate Array
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA-2577 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2016-06-03 | |
| Additional Feature | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | |
| JESD-30 Code | S-PBGA-B2577 | |
| Length | 52.5 mm | |
| Number of CLBs | 147780 | |
| Number of Inputs | 448 | |
| Number of Logic Cells | 2586150 | |
| Number of Outputs | 448 | |
| Number of Terminals | 2577 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | ||
| Organization | 147780 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA2577,51X51,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Packing Method | BOX; TRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 4.24 mm | |
| Supply Voltage-Max | 0.742 V | |
| Supply Voltage-Min | 0.698 V | |
| Supply Voltage-Nom | 0.72 V | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 52.5 mm |
XCVU9P-L2FLGA2577E Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCVU9P-L2FLGA2577E is approximately 26W, depending on the operating frequency, voltage, and usage of the device.
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The XCVU9P-L2FLGA2577E has a dedicated DDR4 memory controller, and implementation requires using the Xilinx Memory Interface Generator (MIG) tool to generate the necessary IP cores and interface logic.
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Yes, the XCVU9P-L2FLGA2577E has built-in support for high-speed serial interfaces like PCIe Gen3 and SATA III, and can be used for implementing these interfaces using the Xilinx PCIe and SATA IP cores.
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Optimizing the XCVU9P-L2FLGA2577E for low power consumption involves using power-aware design techniques, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling, as well as using the Xilinx Power Estimator and Power Analyzer tools.
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Yes, the XCVU9P-L2FLGA2577E has built-in support for cryptographic applications, including AES, RSA, and SHA, and can be used for implementing secure boot, secure communication, and other cryptographic functions.