Part Details for XCVU9P-3FSGD2104E by AMD Xilinx
Results Overview of XCVU9P-3FSGD2104E by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Telecommunications
XCVU9P-3FSGD2104E Information
XCVU9P-3FSGD2104E by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCVU9P-3FSGD2104E
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Programmable ICs | 1401 |
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RFQ |
Part Details for XCVU9P-3FSGD2104E
XCVU9P-3FSGD2104E CAD Models
XCVU9P-3FSGD2104E Part Data Attributes
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XCVU9P-3FSGD2104E
AMD Xilinx
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Datasheet
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XCVU9P-3FSGD2104E
AMD Xilinx
Field Programmable Gate Array,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2016-06-03 | |
| JESD-30 Code | S-PBGA-B2104 | |
| Length | 47.5 mm | |
| Number of CLBs | 147780 | |
| Number of Inputs | 832 | |
| Number of Logic Cells | 2586150 | |
| Number of Outputs | 832 | |
| Number of Terminals | 2104 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 147780 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA2104,46X46,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 4.59 mm | |
| Supply Voltage-Max | 0.927 V | |
| Supply Voltage-Min | 0.873 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 47.5 mm |
Alternate Parts for XCVU9P-3FSGD2104E
This table gives cross-reference parts and alternative options found for XCVU9P-3FSGD2104E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCVU9P-3FSGD2104E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
XCVU9P-3FSGD2104E Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCVU9P-3FSGD2104E is approximately 26W, depending on the operating frequency, voltage, and usage of the device.
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To implement a DDR4 memory interface on the XCVU9P-3FSGD2104E, you need to use the Memory Interface Generator (MIG) tool provided by Xilinx, which generates the necessary IP cores and constraints for the DDR4 interface.
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Yes, the XCVU9P-3FSGD2104E supports high-speed serial interfaces like PCIe Gen3 and SATA III, with data transfer rates up to 8 GT/s and 6 Gb/s, respectively.
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To optimize the XCVU9P-3FSGD2104E for low power consumption, you can use various techniques such as clock gating, power gating, and voltage scaling, as well as optimize the design for low power using Xilinx's Vivado Design Suite.
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The maximum operating frequency of the XCVU9P-3FSGD2104E is approximately 500 MHz, depending on the specific device grade and operating conditions.