Part Details for XCVM1502-2MSEVSVA2197 by AMD Xilinx
Results Overview of XCVM1502-2MSEVSVA2197 by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCVM1502-2MSEVSVA2197 Information
XCVM1502-2MSEVSVA2197 by AMD Xilinx is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCVM1502-2MSEVSVA2197
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 821 |
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RFQ |
Part Details for XCVM1502-2MSEVSVA2197
XCVM1502-2MSEVSVA2197 CAD Models
XCVM1502-2MSEVSVA2197 Part Data Attributes
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XCVM1502-2MSEVSVA2197
AMD Xilinx
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Datasheet
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XCVM1502-2MSEVSVA2197
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA2197, FCBGA-2197
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-2197 | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B2197 | |
| JESD-609 Code | e1 | |
| Length | 45 mm | |
| Number of Terminals | 2197 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA2197,47X47,36 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 4 mm | |
| Supply Voltage-Max | 0.825 V | |
| Supply Voltage-Min | 0.775 V | |
| Supply Voltage-Nom | 0.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.92 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 45 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |