Part Details for XCVM1502-2MLEVSVA2197 by AMD
Results Overview of XCVM1502-2MLEVSVA2197 by AMD
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCVM1502-2MLEVSVA2197 Information
XCVM1502-2MLEVSVA2197 by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCVM1502-2MLEVSVA2197
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-XCVM1502-2MLEVSVA2197-ND
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DigiKey | IC VERSALPRIME ACAP FPGA 2197BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$10,687.5000 | Buy Now |
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DISTI #
XCVM1502-2MLEVSVA2197
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Avnet Americas | XCVM1502-2MLEVSVA2197 - Bulk (Alt: XCVM1502-2MLEVSVA2197) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Bulk | 0 |
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$9,832.5000 | Buy Now |
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DISTI #
217-X15022MLEVSVA219
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Mouser Electronics | SoC FPGA XCVM1502-2MLEVSVA2197 RoHS: Compliant | 0 |
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$10,515.3100 | Order Now |
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DISTI #
XCVM1502-2MLEVSVA2197
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Avnet Silica | XCVM15022MLEVSVA2197 (Alt: XCVM1502-2MLEVSVA2197) RoHS: Compliant Min Qty: 1 Package Multiple: 12 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for XCVM1502-2MLEVSVA2197
XCVM1502-2MLEVSVA2197 CAD Models
XCVM1502-2MLEVSVA2197 Part Data Attributes
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XCVM1502-2MLEVSVA2197
AMD
Buy Now
Datasheet
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Compare Parts:
XCVM1502-2MLEVSVA2197
AMD
Microprocessor Circuit, CMOS, PBGA2197, FCBGA-2197
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-2197 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| JESD-30 Code | S-PBGA-B2197 | |
| JESD-609 Code | e1 | |
| Length | 45 mm | |
| Number of Terminals | 2197 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA2197,47X47,36 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Seated Height-Max | 4 mm | |
| Supply Voltage-Max | 0.825 V | |
| Supply Voltage-Min | 0.775 V | |
| Supply Voltage-Nom | 0.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.92 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |