Datasheets
XCVC1502-2MLINSVG1369 by:

Microprocessor Circuit, CMOS, PBGA1369, FCBGA-1369

Part Details for XCVC1502-2MLINSVG1369 by AMD

Results Overview of XCVC1502-2MLINSVG1369 by AMD

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XCVC1502-2MLINSVG1369 Information

XCVC1502-2MLINSVG1369 by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for XCVC1502-2MLINSVG1369

Part # Distributor Description Stock Price Buy
DISTI # 122-XCVC1502-2MLINSVG1369-ND
DigiKey IC VERSAL AI-CORE FPGA 1369BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $26,002.5000
$26,002.5000 Buy Now
DISTI # XCVC1502-2MLINSVG1369
Avnet Americas XCVC1502-2MLINSVG1369 - Bulk (Alt: XCVC1502-2MLINSVG1369) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Bulk 0
  • 1 $25,482.4500
$25,482.4500 Buy Now
DISTI # 217-15022MLINSVG1369
Mouser Electronics SoC FPGA XCVC1502-2MLINSVG1369 RoHS: Compliant 0
  • 1 $25,583.5600
$25,583.5600 Order Now
DISTI # XCVC1502-2MLINSVG1369
Avnet Silica XCVC15022MLINSVG1369 (Alt: XCVC1502-2MLINSVG1369) RoHS: Compliant Min Qty: 1 Package Multiple: 24 Lead time: 17 Weeks, 0 Days Silica - 0
Buy Now
DISTI # XCVC1502-2MLINSVG1369
EBV Elektronik XCVC15022MLINSVG1369 (Alt: XCVC1502-2MLINSVG1369) RoHS: Compliant Min Qty: 1 Package Multiple: 24 Lead time: 18 Weeks, 0 Days EBV - 0
Buy Now

Part Details for XCVC1502-2MLINSVG1369

XCVC1502-2MLINSVG1369 CAD Models

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XCVC1502-2MLINSVG1369 Part Data Attributes

XCVC1502-2MLINSVG1369 AMD
Buy Now Datasheet
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XCVC1502-2MLINSVG1369 AMD Microprocessor Circuit, CMOS, PBGA1369, FCBGA-1369
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FCBGA-1369
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
JESD-30 Code S-PBGA-B1369
Length 35 mm
Number of Terminals 1369
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Equivalence Code BGA1369,37X37,36
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Seated Height-Max 4 mm
Supply Voltage-Max 0.825 V
Supply Voltage-Min 0.775 V
Supply Voltage-Nom 0.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.92 mm
Terminal Position BOTTOM
Width 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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