Part Details for XCVC1502-2LSENSVG1369 by AMD
Results Overview of XCVC1502-2LSENSVG1369 by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XCVC1502-2LSENSVG1369 Information
XCVC1502-2LSENSVG1369 by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XCVC1502-2LSENSVG1369
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-XCVC1502-2LSENSVG1369-ND
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DigiKey | IC VERSAL AI-CORE FPGA 1369BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$20,802.5000 | Buy Now |
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DISTI #
XCVC1502-2LSENSVG1369
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Avnet Americas | Advanced Compute Acceleration Platform 800MHz 0.7V 1369-Pin FPBGA Tray/Box - Bulk (Alt: XCVC1502-2LSENSVG1369) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Bulk | 0 |
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$20,386.4500 | Buy Now |
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DISTI #
217-15022LSENSVG1369
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Mouser Electronics | SoC FPGA XCVC1502-2LSENSVG1369 RoHS: Compliant | 0 |
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$20,467.3400 | Order Now |
Part Details for XCVC1502-2LSENSVG1369
XCVC1502-2LSENSVG1369 CAD Models
XCVC1502-2LSENSVG1369 Part Data Attributes
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XCVC1502-2LSENSVG1369
AMD
Buy Now
Datasheet
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Compare Parts:
XCVC1502-2LSENSVG1369
AMD
Microprocessor Circuit, CMOS, PBGA1369, FCBGA-1369
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FCBGA-1369 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| JESD-30 Code | S-PBGA-B1369 | |
| Length | 35 mm | |
| Number of Terminals | 1369 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1369,37X37,36 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Seated Height-Max | 4 mm | |
| Supply Voltage-Max | 0.724 V | |
| Supply Voltage-Min | 0.676 V | |
| Supply Voltage-Nom | 0.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.92 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |