Part Details for XCR3512XL-12FTG256I by AMD Xilinx
Results Overview of XCR3512XL-12FTG256I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCR3512XL-12FTG256I Information
XCR3512XL-12FTG256I by AMD Xilinx is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCR3512XL-12FTG256I
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 661 |
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RFQ |
Part Details for XCR3512XL-12FTG256I
XCR3512XL-12FTG256I CAD Models
XCR3512XL-12FTG256I Part Data Attributes
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XCR3512XL-12FTG256I
AMD Xilinx
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Datasheet
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XCR3512XL-12FTG256I
AMD Xilinx
EE PLD, 12ns, 512-Cell, CMOS, PBGA256, FBGA-256
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 12 Weeks | |
Additional Feature | YES | |
Clock Frequency-Max | 77 MHz | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
JTAG BST | YES | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | ||
Number of I/O Lines | 212 | |
Number of Macro Cells | 512 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 0 DEDICATED INPUTS, 212 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | EE PLD | |
Propagation Delay | 12 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
Alternate Parts for XCR3512XL-12FTG256I
This table gives cross-reference parts and alternative options found for XCR3512XL-12FTG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCR3512XL-12FTG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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XCR3512XL-12FT256I | AMD Xilinx | Check for Price | EE PLD, 12ns, 512-Cell, CMOS, PBGA256, FBGA-256 | XCR3512XL-12FTG256I vs XCR3512XL-12FT256I |
LC5512MV-75F256C | Lattice Semiconductor Corporation | Check for Price | EE PLD, 9.5ns, 512-Cell, CMOS, PBGA256, FPBGA-256 | XCR3512XL-12FTG256I vs LC5512MV-75F256C |
LC5512MV-75FN256I | Lattice Semiconductor Corporation | Check for Price | EE PLD, 9.5ns, 512-Cell, CMOS, PBGA256, LEAD FREE, FPBGA-256 | XCR3512XL-12FTG256I vs LC5512MV-75FN256I |
XCR3512XL-10FT256I | AMD Xilinx | Check for Price | EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 | XCR3512XL-12FTG256I vs XCR3512XL-10FT256I |
XCR3512XL-10FT256I | AMD | Check for Price | EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 | XCR3512XL-12FTG256I vs XCR3512XL-10FT256I |
XCR3512XL-10FTG256I | AMD Xilinx | Check for Price | EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 | XCR3512XL-12FTG256I vs XCR3512XL-10FTG256I |
M4A3-512/192-10FAC | Lattice Semiconductor Corporation | Check for Price | EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FPBGA-256 | XCR3512XL-12FTG256I vs M4A3-512/192-10FAC |
XCR3512XL-7FT256C | AMD | Check for Price | EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256, FBGA-256 | XCR3512XL-12FTG256I vs XCR3512XL-7FT256C |
XCR3512XL-10FT256C | AMD | Check for Price | EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 | XCR3512XL-12FTG256I vs XCR3512XL-10FT256C |
M4A3-512/192-7FANC | Lattice Semiconductor Corporation | Check for Price | EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256, LEAD FREE, FPBGA-256 | XCR3512XL-12FTG256I vs M4A3-512/192-7FANC |
XCR3512XL-12FTG256I Frequently Asked Questions (FAQ)
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The XCR3512XL-12FTG256I has an operating temperature range of -40°C to 100°C.
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A reliable POR circuit can be implemented using an external resistor-capacitor (RC) network and a voltage supervisor IC. The Xilinx UG570 guide provides more details on implementing a POR circuit.
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Xilinx provides guidelines for PCB layout and routing in the UG583 guide. It's essential to follow these guidelines to ensure signal integrity and minimize noise.
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Timing closure can be optimized by using the Xilinx Vivado Design Suite, which provides tools for timing analysis and optimization. Additionally, following the Xilinx UG949 guide on timing closure can help.
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The recommended decoupling capacitor values and placement are described in the Xilinx UG575 guide. Typically, 0.1uF and 1uF capacitors are used, and they should be placed close to the FPGA's power pins.