Datasheets
XCR3512XL-12FTG256I by:

EE PLD, 12ns, 512-Cell, CMOS, PBGA256, FBGA-256

Part Details for XCR3512XL-12FTG256I by AMD Xilinx

Results Overview of XCR3512XL-12FTG256I by AMD Xilinx

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Applications Industrial Automation

XCR3512XL-12FTG256I Information

XCR3512XL-12FTG256I by AMD Xilinx is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XCR3512XL-12FTG256I

Part # Distributor Description Stock Price Buy
Vyrian Peripheral ICs 661
RFQ

Part Details for XCR3512XL-12FTG256I

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XCR3512XL-12FTG256I Part Data Attributes

XCR3512XL-12FTG256I AMD Xilinx
Buy Now Datasheet
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XCR3512XL-12FTG256I AMD Xilinx EE PLD, 12ns, 512-Cell, CMOS, PBGA256, FBGA-256
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-256
Pin Count 256
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks
Additional Feature YES
Clock Frequency-Max 77 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
JTAG BST YES
Length 17 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs
Number of I/O Lines 212
Number of Macro Cells 512
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 212 I/O
Output Function MACROCELL
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type EE PLD
Propagation Delay 12 ns
Qualification Status Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.7 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

Alternate Parts for XCR3512XL-12FTG256I

This table gives cross-reference parts and alternative options found for XCR3512XL-12FTG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCR3512XL-12FTG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XCR3512XL-12FT256I AMD Xilinx Check for Price EE PLD, 12ns, 512-Cell, CMOS, PBGA256, FBGA-256 XCR3512XL-12FTG256I vs XCR3512XL-12FT256I
LC5512MV-75F256C Lattice Semiconductor Corporation Check for Price EE PLD, 9.5ns, 512-Cell, CMOS, PBGA256, FPBGA-256 XCR3512XL-12FTG256I vs LC5512MV-75F256C
LC5512MV-75FN256I Lattice Semiconductor Corporation Check for Price EE PLD, 9.5ns, 512-Cell, CMOS, PBGA256, LEAD FREE, FPBGA-256 XCR3512XL-12FTG256I vs LC5512MV-75FN256I
XCR3512XL-10FT256I AMD Xilinx Check for Price EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 XCR3512XL-12FTG256I vs XCR3512XL-10FT256I
XCR3512XL-10FT256I AMD Check for Price EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 XCR3512XL-12FTG256I vs XCR3512XL-10FT256I
XCR3512XL-10FTG256I AMD Xilinx Check for Price EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 XCR3512XL-12FTG256I vs XCR3512XL-10FTG256I
M4A3-512/192-10FAC Lattice Semiconductor Corporation Check for Price EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FPBGA-256 XCR3512XL-12FTG256I vs M4A3-512/192-10FAC
XCR3512XL-7FT256C AMD Check for Price EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256, FBGA-256 XCR3512XL-12FTG256I vs XCR3512XL-7FT256C
XCR3512XL-10FT256C AMD Check for Price EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FBGA-256 XCR3512XL-12FTG256I vs XCR3512XL-10FT256C
M4A3-512/192-7FANC Lattice Semiconductor Corporation Check for Price EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256, LEAD FREE, FPBGA-256 XCR3512XL-12FTG256I vs M4A3-512/192-7FANC

XCR3512XL-12FTG256I Related Parts

XCR3512XL-12FTG256I Frequently Asked Questions (FAQ)

  • The XCR3512XL-12FTG256I has an operating temperature range of -40°C to 100°C.

  • A reliable POR circuit can be implemented using an external resistor-capacitor (RC) network and a voltage supervisor IC. The Xilinx UG570 guide provides more details on implementing a POR circuit.

  • Xilinx provides guidelines for PCB layout and routing in the UG583 guide. It's essential to follow these guidelines to ensure signal integrity and minimize noise.

  • Timing closure can be optimized by using the Xilinx Vivado Design Suite, which provides tools for timing analysis and optimization. Additionally, following the Xilinx UG949 guide on timing closure can help.

  • The recommended decoupling capacitor values and placement are described in the Xilinx UG575 guide. Typically, 0.1uF and 1uF capacitors are used, and they should be placed close to the FPGA's power pins.

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