Part Details for XCKU9P-1FFVE900I by AMD Xilinx
Results Overview of XCKU9P-1FFVE900I by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCKU9P-1FFVE900I Information
XCKU9P-1FFVE900I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCKU9P-1FFVE900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 1402 |
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RFQ |
Part Details for XCKU9P-1FFVE900I
XCKU9P-1FFVE900I CAD Models
XCKU9P-1FFVE900I Part Data Attributes
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XCKU9P-1FFVE900I
AMD Xilinx
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Datasheet
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XCKU9P-1FFVE900I
AMD Xilinx
Field Programmable Gate Array,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Date Of Intro | 2016-06-03 | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 34260 | |
| Number of Inputs | 304 | |
| Number of Logic Cells | 599550 | |
| Number of Outputs | 304 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 34260 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 3.42 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 31 mm |
Alternate Parts for XCKU9P-1FFVE900I
This table gives cross-reference parts and alternative options found for XCKU9P-1FFVE900I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCKU9P-1FFVE900I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XCKU9P-1FFVE900E | AMD | $1,884.8332 | Field Programmable Gate Array, 599550-Cell, PBGA900, | XCKU9P-1FFVE900I vs XCKU9P-1FFVE900E |
| XCKU9P-1FFVE900I | AMD | Check for Price | Field Programmable Gate Array, 599550-Cell, PBGA900, | XCKU9P-1FFVE900I vs XCKU9P-1FFVE900I |
XCKU9P-1FFVE900I Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCKU9P-1FFVE900I is approximately 25W, but this can vary depending on the specific application and usage.
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The XCKU9P-1FFVE900I has a built-in DDR4 memory controller, and implementation requires using the Memory Interface Generator (MIG) tool in Vivado Design Suite to generate the necessary IP and constraints.
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Yes, the XCKU9P-1FFVE900I has built-in high-speed serial transceivers that support PCIe Gen3 and SATA III, and can be used for high-speed serial interfaces.
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Optimizing the XCKU9P-1FFVE900I for low power consumption involves using power-aware design techniques, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling, as well as using the Power Analyzer tool in Vivado Design Suite to identify and optimize power-hungry areas of the design.
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Yes, the XCKU9P-1FFVE900I is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace and defense applications, including radiation tolerance and high-temperature operation.