Part Details for XCKU13P-3FFVE900E by AMD
Results Overview of XCKU13P-3FFVE900E by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCKU13P-3FFVE900E Information
XCKU13P-3FFVE900E by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XCKU13P-3FFVE900E
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XCKU13P-3FFVE900E
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Avnet Silica | FPGA XCKU13P Family 746550 Logic Units 746550 Cells 1066MHz 20nm Technology 09V 900Pin FCBGA (Alt: XCKU13P-3FFVE900E) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Part Details for XCKU13P-3FFVE900E
XCKU13P-3FFVE900E CAD Models
XCKU13P-3FFVE900E Part Data Attributes
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XCKU13P-3FFVE900E
AMD
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Datasheet
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XCKU13P-3FFVE900E
AMD
Field Programmable Gate Array, 746550-Cell, PBGA900,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | BGA-900 | |
Reach Compliance Code | compliant | |
Samacsys Manufacturer | AMD | |
JESD-30 Code | S-PBGA-B900 | |
JESD-609 Code | e1 | |
Length | 31 mm | |
Moisture Sensitivity Level | 4 | |
Number of CLBs | 42660 | |
Number of Inputs | 304 | |
Number of Logic Cells | 746550 | |
Number of Outputs | 304 | |
Number of Terminals | 900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Organization | 42660 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 3.42 mm | |
Supply Voltage-Max | 0.927 V | |
Supply Voltage-Min | 0.873 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 31 mm |
Alternate Parts for XCKU13P-3FFVE900E
This table gives cross-reference parts and alternative options found for XCKU13P-3FFVE900E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCKU13P-3FFVE900E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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XCKU13P-3FFVE900I | AMD Xilinx | Check for Price | Field Programmable Gate Array, | XCKU13P-3FFVE900E vs XCKU13P-3FFVE900I |
XCKU13P-3FFVE900E | AMD Xilinx | Check for Price | Field Programmable Gate Array, | XCKU13P-3FFVE900E vs XCKU13P-3FFVE900E |