Part Details for XCKU11P-2FFVE1517I by AMD Xilinx
Results Overview of XCKU11P-2FFVE1517I by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
XCKU11P-2FFVE1517I Information
XCKU11P-2FFVE1517I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for XCKU11P-2FFVE1517I
XCKU11P-2FFVE1517I CAD Models
XCKU11P-2FFVE1517I Part Data Attributes
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XCKU11P-2FFVE1517I
AMD Xilinx
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Datasheet
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XCKU11P-2FFVE1517I
AMD Xilinx
Field Programmable Gate Array,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.7.B | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Date Of Intro | 2016-06-03 | |
| JESD-30 Code | S-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Length | 40 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 37320 | |
| Number of Inputs | 512 | |
| Number of Logic Cells | 653100 | |
| Number of Outputs | 512 | |
| Number of Terminals | 1517 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 37320 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 3.51 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 40 mm |
Alternate Parts for XCKU11P-2FFVE1517I
This table gives cross-reference parts and alternative options found for XCKU11P-2FFVE1517I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCKU11P-2FFVE1517I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
XCKU11P-2FFVE1517I Frequently Asked Questions (FAQ)
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The maximum power consumption of the XCKU11P-2FFVE1517I is approximately 12W, but this can vary depending on the specific application and usage.
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To implement a DDR3 memory interface on the XCKU11P-2FFVE1517I, you can use the MIG (Memory Interface Generator) tool provided by Xilinx. This tool generates a customized DDR3 memory controller that can be integrated into your design.
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The maximum clock frequency supported by the XCKU11P-2FFVE1517I is 500 MHz, but this can vary depending on the specific application and usage.
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To optimize power consumption on the XCKU11P-2FFVE1517I, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, Xilinx provides a Power Estimator tool that can help estimate power consumption and identify areas for optimization.
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The XCKU11P-2FFVE1517I has a total of 560 I/O pins, but not all of them are available for use. The actual number of available I/O pins depends on the specific package and configuration.