Part Details for XCF02SVOG20C by AMD Xilinx
Results Overview of XCF02SVOG20C by AMD Xilinx
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XCF02SVOG20C Information
XCF02SVOG20C by AMD Xilinx is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for XCF02SVOG20C
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 1108 |
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RFQ | ||
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Quest Components | IC,SERIAL EEPROM,NOR FLASH,CMOS,TSSOP,20PIN,PLASTIC | 10 |
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$65.7000 / $73.0000 | Buy Now |
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Ameya Holding Limited | IC PROM SRL FOR 2M GATE 20-TSSOP | 671 |
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RFQ | |
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ComSIT USA | Configuration Memory, 2MX1, Serial, CMOS, PDSO20 ECCN: EAR99 RoHS: Not Compliant |
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RFQ | |
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Chip 1 Exchange | INSTOCK | 296 |
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RFQ | |
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Vyrian | Memory ICs | 776 |
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RFQ | |
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Win Source Electronics | IC PROM SRL FOR 2M GATE 20-TSSOP | 8880 |
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$15.0000 / $19.3750 | Buy Now |
Part Details for XCF02SVOG20C
XCF02SVOG20C CAD Models
XCF02SVOG20C Part Data Attributes
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XCF02SVOG20C
AMD Xilinx
Buy Now
Datasheet
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XCF02SVOG20C
AMD Xilinx
Configuration Memory, 2MX1, Serial, CMOS, PDSO20, LEAD-FREE, PLASTIC, TSSOP-20
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | TSSOP | |
Package Description | LEAD-FREE, PLASTIC, TSSOP-20 | |
Pin Count | 20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Additional Feature | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | |
Data Retention Time-Min | 20 | |
Endurance | 20000 Write/Erase Cycles | |
JESD-30 Code | R-PDSO-G20 | |
JESD-609 Code | e3 | |
Length | 6.5024 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | CONFIGURATION MEMORY | |
Memory Width | 1 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 20 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2MX1 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP20,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.19 mm | |
Standby Current-Max | 0.001 A | |
Supply Current-Max | 0.01 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Type | NOR TYPE | |
Width | 4.4 mm |
Alternate Parts for XCF02SVOG20C
This table gives cross-reference parts and alternative options found for XCF02SVOG20C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XCF02SVOG20C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
XCF02SVO20CES | AMD Xilinx | Check for Price | Configuration Memory, 2MX1, Serial, CMOS, PDSO20, PLASTIC, TSSOP-20 | XCF02SVOG20C vs XCF02SVO20CES |
XCF02SVOG20C Frequently Asked Questions (FAQ)
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The recommended PCB layout and routing for the XCF02SVOG20C can be found in the Xilinx PCB Design Guide (UG583) and the XCF02SVOG20C PCB Design Files, which provide guidelines for signal integrity, power distribution, and thermal management.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
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The XCF02SVOG20C has a maximum junction temperature of 100°C. Ensure good airflow, use a heat sink if necessary, and follow the thermal management guidelines in the Xilinx Thermal Management Guide (UG586) to prevent overheating.
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Use the Xilinx Secure Boot and Encryption Guide (UG1235) to implement secure boot and encryption on the XCF02SVOG20C. This guide provides instructions for generating and managing encryption keys, and configuring secure boot modes.
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The XCF02SVOG20C is not designed for high-reliability applications. For such applications, consider using Xilinx's radiation-tolerant or radiation-hardened devices, such as the XQR or XQNR families, which are designed for high-reliability and harsh environments.