Part Details for XC7Z015-2CLG485E by AMD Xilinx
Results Overview of XC7Z015-2CLG485E by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XC7Z015-2CLG485E Information
XC7Z015-2CLG485E by AMD Xilinx is a Multifunction Peripheral.
Multifunction Peripherals are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for XC7Z015-2CLG485E
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 17 |
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RFQ | ||
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Quest Components | MICROPROCESSOR CIRCUIT, CMOS, PBGA485 | 13 |
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$277.4880 / $303.5025 | Buy Now |
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Vyrian | Peripheral ICs | 102 |
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RFQ |
Part Details for XC7Z015-2CLG485E
XC7Z015-2CLG485E CAD Models
XC7Z015-2CLG485E Part Data Attributes
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XC7Z015-2CLG485E
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC7Z015-2CLG485E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA485, BGA-485
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | CSBGA-485 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 65 Weeks |
XC7Z015-2CLG485E Frequently Asked Questions (FAQ)
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The maximum power consumption of XC7Z015-2CLG485E is approximately 2.5W, depending on the operating frequency and usage.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating frequency of XC7Z015-2CLG485E is 330 MHz, but it can be overclocked to higher frequencies with careful design and thermal management.
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To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal routing, and implement signal integrity techniques such as differential signaling, shielding, and termination.
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To manage thermal issues, ensure good airflow around the device, use thermal interfaces such as heat sinks or thermal pads, and implement thermal monitoring and shutdown mechanisms to prevent overheating.