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SoC, CMOS, PBGA400, CSBGA-400
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC7Z014S-1CLG400I by AMD is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
32AC9843
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Newark | Psoc, Arm Cortex-A9, 667Mhz, Bga-400, Product Range:Zynq Family 7000S Series Microprocessors, Cpu Speed:667Mhz, Core Architecture:Arm Cortex-A9, Mpu Case Style:Bga, No. Of Pins:400Pins, Msl:-, Ic Case/Package:Bga Rohs Compliant: Yes |Amd XC7Z014S-1CLG400I RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
|
$132.5000 | Buy Now |
DISTI #
122-2003-ND
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DigiKey | IC SOC CORTEX-A9 667MHZ 400BGA Min Qty: 1 Lead time: 16 Weeks Container: Tray |
103 In Stock |
|
$132.5100 | Buy Now |
DISTI #
XC7Z014S-1CLG400I
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Avnet Americas | System On Chip Processor, Zynq-7000, ARM Cortex-A9, 667 MHz, CSBGA, 400 Pins - Trays (Alt: XC7Z014S-1CLG400I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$127.7775 | Buy Now |
DISTI #
217-C7Z014S-1CLG400I
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Mouser Electronics | SoC FPGA XC7Z014S-1CLG400I RoHS: Compliant | 0 |
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$132.5000 | Order Now |
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XC7Z014S-1CLG400I
AMD
Buy Now
Datasheet
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Compare Parts:
XC7Z014S-1CLG400I
AMD
SoC, CMOS, PBGA400, CSBGA-400
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | CSBGA-400 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
JESD-30 Code | S-PBGA-B400 | |
JESD-609 Code | e3 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 400 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA400,20X20,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | SoC |
The maximum power consumption of XC7Z014S-1CLG400I is approximately 1.5W, but it can vary depending on the design and operating conditions.
You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates the necessary IP cores and interface logic for the DDR3 memory interface.
The maximum clock frequency supported by XC7Z014S-1CLG400I is 450 MHz, but it can vary depending on the design and operating conditions.
You can optimize the power consumption of XC7Z014S-1CLG400I by using power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, you can use the Xilinx Power Estimator (XPE) tool to estimate and optimize power consumption.
The XC7Z014S-1CLG400I has a total of 240 I/O pins, but the number of available I/O pins depends on the package and the design requirements.