Datasheets
XC7K325T-3FBG676E by:

Field Programmable Gate Array, 25475 CLBs, 1412MHz, 326080-Cell, CMOS, PBGA676, FBGA-676

Part Details for XC7K325T-3FBG676E by AMD Xilinx

Results Overview of XC7K325T-3FBG676E by AMD Xilinx

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XC7K325T-3FBG676E Information

XC7K325T-3FBG676E by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC7K325T-3FBG676E

Part # Distributor Description Stock Price Buy
MacroQuest Electronics FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 676-Pin Lidless FCBGA 2000
  • 1 $2,389.6400
  • 40 $2,189.6600
  • 200 $1,989.6800
$1,989.6800 / $2,389.6400 Buy Now
Vyrian Peripheral ICs 1168
RFQ

Part Details for XC7K325T-3FBG676E

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XC7K325T-3FBG676E Part Data Attributes

XC7K325T-3FBG676E AMD Xilinx
Buy Now Datasheet
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XC7K325T-3FBG676E AMD Xilinx Field Programmable Gate Array, 25475 CLBs, 1412MHz, 326080-Cell, CMOS, PBGA676, FBGA-676
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Pin Count 676
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 65 Weeks
Clock Frequency-Max 1412 MHz
Combinatorial Delay of a CLB-Max 0.58 ns
JESD-30 Code S-PBGA-B676
JESD-609 Code e1
Length 27 mm
Moisture Sensitivity Level 4
Number of CLBs 25475
Number of Inputs 400
Number of Logic Cells 326080
Number of Outputs 400
Number of Terminals 676
Organization 25475 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.54 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

Alternate Parts for XC7K325T-3FBG676E

This table gives cross-reference parts and alternative options found for XC7K325T-3FBG676E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC7K325T-3FBG676E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC7K325T-3FB676E AMD Xilinx Check for Price Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA676, XC7K325T-3FBG676E vs XC7K325T-3FB676E
Part Number Manufacturer Composite Price Description Compare
XC7K325T-3FBG676E AMD Check for Price Field Programmable Gate Array, 25475 CLBs, 1412MHz, 326080-Cell, CMOS, PBGA676, XC7K325T-3FBG676E vs XC7K325T-3FBG676E
XC7K325T-3FF676E AMD Check for Price Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA676, XC7K325T-3FBG676E vs XC7K325T-3FF676E
XC7K325T-3FB676E AMD Check for Price Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA676, XC7K325T-3FBG676E vs XC7K325T-3FB676E

XC7K325T-3FBG676E Related Parts

XC7K325T-3FBG676E Frequently Asked Questions (FAQ)

  • The maximum power consumption of XC7K325T-3FBG676E is approximately 12W, depending on the operating frequency, voltage, and usage of the device.

  • To implement a DDR3 memory interface with XC7K325T-3FBG676E, you need to use the Memory Interface Generator (MIG) tool provided by Xilinx, which generates the necessary IP cores and interface logic for the DDR3 memory interface.

  • Yes, XC7K325T-3FBG676E is capable of supporting high-speed serial interfaces like PCIe and SATA, thanks to its high-speed transceivers and built-in PCIe and SATA IP cores.

  • To optimize the power consumption of XC7K325T-3FBG676E, you can use various techniques such as clock gating, power gating, and voltage scaling, as well as using the Xilinx Power Estimator (XPE) tool to estimate and optimize power consumption.

  • Yes, XC7K325T-3FBG676E is fully compatible with Xilinx's Vivado Design Suite, which provides a comprehensive development environment for designing, implementing, and verifying digital systems.

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