Datasheets
XC7K325T-1FFG900C by:

Field Programmable Gate Array, 25475 CLBs, 1098MHz, 326080-Cell, CMOS, PBGA900,

Part Details for XC7K325T-1FFG900C by AMD

Results Overview of XC7K325T-1FFG900C by AMD

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XC7K325T-1FFG900C Information

XC7K325T-1FFG900C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC7K325T-1FFG900C

Part # Distributor Description Stock Price Buy
DISTI # 47AC6528
Newark Fpga, 326080 Logic Cells, Fcbga-900, Fpga Type:-, No. Of Logic Cells:326080Logic Cells, Ic Case/Package:Fcbga, No. Of Pins:900Pins, Speed Grade:1, No.of User I/Os:350I/O S, Process Technology:28Nm (Hkmg), Ic Mounting:Surface Mount Rohs Compliant: Yes |Amd XC7K325T-1FFG900C RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 0
  • 1 $2,130.1100
$2,130.1100 Buy Now
DISTI # 122-1809-ND
DigiKey IC FPGA 500 I/O 900FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 1 $2,165.0000
$2,165.0000 Buy Now
DISTI # 217-C7K325T-1FFG900C
Mouser Electronics FPGA - Field Programmable Gate Array XC7K325T-1FFG900C RoHS: Compliant 2
  • 1 $2,130.1100
$2,130.1100 Buy Now
DISTI # XC7K325T-1FFG900C
Avnet Asia FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin FC-BGA (Alt: XC7K325T-1FFG900C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days 0
  • 1 $2,278.9473
  • 2 $2,249.3506
  • 3 $2,220.5130
  • 5 $2,192.4050
  • 10 $2,138.2717
  • 25 $2,086.7470
  • 50 $2,037.6471
$2,037.6471 / $2,278.9473 Buy Now
DISTI # XC7K325T-1FFG900C
Avnet Silica (Alt: XC7K325T-1FFG900C) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 17 Weeks, 0 Days Silica - 0
Buy Now
DISTI # XC7K325T-1FFG900C
EBV Elektronik (Alt: XC7K325T-1FFG900C) RoHS: Compliant Min Qty: 1 Package Multiple: 27 Lead time: 18 Weeks, 0 Days EBV - 0
Buy Now

Part Details for XC7K325T-1FFG900C

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XC7K325T-1FFG900C Part Data Attributes

XC7K325T-1FFG900C AMD
Buy Now Datasheet
Compare Parts:
XC7K325T-1FFG900C AMD Field Programmable Gate Array, 25475 CLBs, 1098MHz, 326080-Cell, CMOS, PBGA900,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description BGA-900
Reach Compliance Code compliant
Factory Lead Time 16 Weeks
Samacsys Manufacturer AMD
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 0.3 ns
JESD-30 Code S-PBGA-B900
JESD-609 Code e1
Length 31 mm
Moisture Sensitivity Level 4
Number of CLBs 25475
Number of Inputs 500
Number of Logic Cells 326080
Number of Outputs 500
Number of Terminals 900
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 25475 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.35 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 31 mm

Alternate Parts for XC7K325T-1FFG900C

This table gives cross-reference parts and alternative options found for XC7K325T-1FFG900C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC7K325T-1FFG900C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC7K325T-1FFG900I AMD $2,593.8636 Field Programmable Gate Array, 25475 CLBs, 1098MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-1FFG900C vs XC7K325T-1FFG900I
Part Number Manufacturer Composite Price Description Compare
XC7K325T-1FBG900I AMD $1,954.0463 Field Programmable Gate Array, 25475 CLBs, 1098MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-1FFG900C vs XC7K325T-1FBG900I
XC7K325T-1FF900I AMD $2,432.8852 Field Programmable Gate Array, 326080 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, FBGA-900 XC7K325T-1FFG900C vs XC7K325T-1FF900I
XC7K325T-1FFG900E AMD Check for Price Field Programmable Gate Array, PBGA900, FBGA-900 XC7K325T-1FFG900C vs XC7K325T-1FFG900E
XC7K325T-1FB900C AMD Check for Price Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-1FFG900C vs XC7K325T-1FB900C
XC7K325T-1FBG900E AMD Check for Price Field Programmable Gate Array, PBGA900, FBGA-900 XC7K325T-1FFG900C vs XC7K325T-1FBG900E
XC7K325T-1FB900I AMD Check for Price Field Programmable Gate Array, 25475 CLBs, PBGA900, FBGA-900 XC7K325T-1FFG900C vs XC7K325T-1FB900I
XC7K325T-1FF900C AMD Xilinx Check for Price Field Programmable Gate Array, 1818MHz, 326080-Cell, CMOS, PBGA900, XC7K325T-1FFG900C vs XC7K325T-1FF900C

XC7K325T-1FFG900C Related Parts

XC7K325T-1FFG900C Frequently Asked Questions (FAQ)

  • The maximum operating frequency of the XC7K325T-1FFG900C is 500 MHz, but it depends on the specific application and design implementation.

  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and implement clock gating and dynamic voltage and frequency scaling (DVFS) in your design.

  • The XC7K325T-1FFG900C has a total of 326,720 logic cells, 21,280 Kbits of block RAM, and 900 Kb of user flash memory.

  • Yes, the XC7K325T-1FFG900C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high-performance and low-power capabilities.

  • To ensure signal integrity and reduce noise, use the Xilinx ISE Design Suite to perform signal integrity analysis, and implement proper PCB design techniques, such as using differential pairs, shielding, and decoupling capacitors.

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