Part Details for XC7A200T-L2FBG676E by AMD
Results Overview of XC7A200T-L2FBG676E by AMD
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XC7A200T-L2FBG676E Information
XC7A200T-L2FBG676E by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC7A200T-L2FBG676E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
47AC6440
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Newark | Fpga, 215360 Logic Cells, Fcbga-676, Fpga Type:Sram Based Fpga, No. Of Logic Cells:215360Logic Cells, Ic Case/Package:Fcbga, No. Of Pins:676Pins, Speed Grade:2L, No.of User I/Os:400I/O S, Process Technology:28Nm (Hkmg) Rohs Compliant: Yes |Amd XC7A200T-L2FBG676E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$390.0000 | Buy Now |
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DISTI #
XC7A200T-L2FBG676E-ND
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DigiKey | IC FPGA 400 I/O 676FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$390.0000 | Buy Now |
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DISTI #
XC7A200T-L2FBG676E
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Avnet Americas | FPGA, Artix-7, MMCM, PLL, 400 I/O's, 394 MHz, 215360 Cells, 950 mV to 1.05 V, FCBGA-676, NCNR - Trays (Alt: XC7A200T-L2FBG676E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$345.0000 | Buy Now |
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DISTI #
217-7A200T-L2FBG676E
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Mouser Electronics | FPGA - Field Programmable Gate Array XC7A200T-L2FBG676E RoHS: Compliant | 3 |
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$390.0000 | Buy Now |
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DISTI #
XC7A200T-L2FBG676E
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Avnet Silica | FPGA Artix7 MMCM PLL 400 IOs 394 MHz 215360 Cells 950 mV to 105 V FCBGA676 NCNR (Alt: XC7A200T-L2FBG676E) RoHS: Compliant Min Qty: 1 Package Multiple: 40 Lead time: 17 Weeks, 0 Days | Silica - 80 |
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Buy Now | |
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DISTI #
XC7A200T-L2FBG676E
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EBV Elektronik | FPGA Artix7 MMCM PLL 400 IOs 394 MHz 215360 Cells 950 mV to 105 V FCBGA676 NCNR (Alt: XC7A200T-L2FBG676E) RoHS: Compliant Min Qty: 2 Package Multiple: 40 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XC7A200T-L2FBG676E
XC7A200T-L2FBG676E CAD Models
XC7A200T-L2FBG676E Part Data Attributes
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XC7A200T-L2FBG676E
AMD
Buy Now
Datasheet
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Compare Parts:
XC7A200T-L2FBG676E
AMD
Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA676,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | BGA-676 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| Additional Feature | ALSO OPERATES AT 1V SUPPLY | |
| Clock Frequency-Max | 1286 MHz | |
| Combinatorial Delay of a CLB-Max | 1.51 ns | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 16825 | |
| Number of Inputs | 400 | |
| Number of Logic Cells | 215360 | |
| Number of Outputs | 400 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 16825 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.54 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |
XC7A200T-L2FBG676E Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC7A200T-L2FBG676E is 500 MHz, but it depends on the specific application, clock domain, and design implementation.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, use low-power modes, and optimize the design for low power consumption.
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The main difference is the operating temperature range. The XC7A200T-L2FBG676E has a commercial temperature range (-40°C to 100°C), while the XC7A200T-L2FBG676C has an industrial temperature range (-40°C to 125°C).
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Yes, the XC7A200T-L2FBG676E is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its high-quality manufacturing process and rigorous testing.
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To ensure signal integrity, use the Xilinx Signal Integrity (SI) tool, follow PCB design guidelines, use differential signaling, and add termination resistors as needed.